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Soitec and ASM team up for SSOI manufacture

Soitec and ASM are putting their heads together to push the benefits of combining strained silicon with SOI, a move which is expected to squeeze even higher performance from CMOS devices.
Soitec and ASM International have announced a strategic partnership to ensure the commercial manufacturability of strained silicon-on-insulator (SSOI) substrates. The partnership combines Soitec s wafer bonding technology and ASM s silicon epitaxial technologies to enable the manufacturing of leading-edge ICs.

Under the agreement, Soitec and ASM will partner to combine Soitec s Smart Cut technology and ASM s manufacturing tool, the Epsilon 3000 epitaxial reactor, to create the industry s first high-volume, production-worthy SSOI substrate solution. The new agreement extends a previous collaboration on Soitec s 300 mm Unibond SOI wafers using ASM s Advance 400 series of vertical furnaces.

"Materials and equipment providers must work closely together, and with IC manufacturers, to deliver advanced solutions that meet their stringent requirements,” said Soitec’s president Andre Auberton-Herve.

“This partnership with Soitec to commercialize SSOI further extends ASM s leadership in supplying single-wafer epitaxial tools with unique production solutions for precisely controlled epitaxial structures,” said Armand Ferro, epitaxy business unit manager at ASM.

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