WIN forms strategic alliance with RF Integration
Using RF Integration s RF/mixed-signal design expertise, the companies will work together to provide complete solutions that require MMIC designs, based on a broad portfolio of GaAs wafer fabrication processes available from WIN.
Products will range from single functions like PAs, attenuators or switches, to integrated solutions such as complete transceivers. Through this collaborative supply chain, both companies can support customers from system specification to chip manufacturing.
"In addition to supporting WIN’s customers to develop their product portfolio using the best-in-class process, working with WIN enhances our ability to deliver high quality and high performance products to the marketplace," said Jean Luc Lembert, VP strategic business development at RF Integration.
"Our 6-inch GaAs processes (HBT and HEMT) are particularly tuned for affordable mass production of MMICs in applications from high volume components, such as handset PA and Switches, to high frequency and high performance components, such as broadband amplifiers and 77 GHz automotive radar MMICs," said Simon Yu, general manager and associate VP of North America and Europe Sales at WIN.
Yu added that the alliance will enable all its different types of customer, include IDMs, fabless design houses, and module and system manufacturers, to turn around their products in rapidly growing markets to meet performance and quality market demands within a short period of time.