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EV Group and SiGen in wafer bonding alliance

Equipment manufacturer EV Group and substrate developer SiGen have formed a partnership to develop low-temperature wafer bonding technologies.
EV Group (EVG), a manufacturer of MEMS and semiconductor wafer processing equipment and Silicon Genesis Corporation (SiGen), a developer of silicon-on-insulator and other engineered substrate technologies, have announced a wide ranging cooperation in the field of low-temperature wafer bonding based on a license of SiGen s NanoBond patents and process technologies.

Both companies will combine their extensive experience in wafer bonding technologies to integrate production proven, next-generation low-temperature bond equipment and processes to the industry.

EVG has developed know-how in low temperature and dry-activated bonding equipment throughout the last 15 years. SiGen has pioneered the use of plasma activation for ultra-clean bond applications and contributes to this agreement with its plasma bonding intellectual property portfolio and related process technologies.

EVG and SiGen have been working together on new developments in modular equipment design for plasma-activated wafer bonding since 1998.

EVG’s LowTemp Dry Activated Plasma bonding process can be applied not only to silicon direct bonding for SOI or strained silicon fabrication but also to applications in the field of compound semiconductors and MEMS.

“Our LowTemp Dry Activated Plasma Bonding technology offers the broadest process flexibility, resulting in the highest bond strength at the lowest possible temperature,” says Peter Podesser CEO of EVG. “Safe system designs, utilizing small volumes of inert, oxidizing or reducing gas in a chamber provide the lowest cost of ownership (COO) with a safety first policy.”

“We at SiGen are excited to license our clean, production proven NanoBond process technologies to EVG, the wafer bonding equipment world leader,” said Francois Henley, founder and CEO of SiGen. "This license augments our relationship and is consistent with our recent transition to focus on licensing, protecting and strengthening our intellectual property.

“The bond processes now offered by EVG can address a wide range of applications due to its flexibility in bond optimization made possible by the variety of plasma gases, pressures and other parameters available.”

High throughput, LowTemp Dry Activated Plasma Bonding will now be offered on EVG s wafer bonding systems and cluster platforms. Both ex-situ and in-situ wafer bonding chambers are available including aligned wafer bonding.

By applying the plasma activation, the surface chemistry of two materials to be bonded can be tailored to allow formation of stronger chemical bonds than achievable for non-activated surfaces. This leads to a significant decrease of the annealing temperature (usually >50%) and annealing time.

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