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VPEC commences shipments of WB-LED chips

VPEC, a Taiwanese epiwafer supplier, has started to ship wafer-bonded (WB)-LED chips to domestic LED packaging manufacturers.
VPEC has started to ship high brightness AlGaInP chips wafer-bonded to a silicon substrate, marking the first time that the Taiwanese epiwafer supplier has shipped chips to its customers.

Michael Yang, CEO of VPEC, said “VPEC’s WB-LEDs are responding to customers’ strong demand to continuously increase the brightness and life for higher performance applications. The product qualification process feedback from several customers was extremely exciting, and VPEC is in the process of expanding the production capacity.”

The wafer-bonding (WB)-LED is based on a patented technology owned by VPEC. The AlGaInP LED is bonded to a silicon substrate with a metal surface, and the original GaAs substrate is subsequently removed.

VPEC says that the metal mirror has a higher effective reflectivity and broader reflectivity angular bandwidth than the alternative using a multi-layer DBR, and reflects the light towards the front surface to significantly improve the total light emission efficiency of LED.

Moreover, since the thermal conductivity of the Si substrate is higher than that of GaAs, heat dissipation of the WB-LED has been greatly improved. Therefore, VPEC claims that the WB-LED can be potentially used for high power applications.

VPEC’s first WB-LED product is 625 nm red LED with >4 lm total flux illumination and

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