News in brief: Communicant, MetroPhotonics etc
After months of uncertainty surrounding the future financing of Germany-based Communicant Semiconductor, it seems that the company, which never really got going, will be disbanded.
The company was set up as a SiGe foundry with investment from Intel, Dubai’s Airport Free Zone Authority, the Brandenburg regional government, and the German federal government. Construction of the company’s fab in the Brandenburg region has now stopped.
The reasons for the collapse seem to be varied, but the venture’s principle investors in Dubai appear to have been unwilling to put the further required funds into Communicant. Dubai is currently planning major investment in semiconductor manufacturing infrastructure within its own borders at the so-called Dubai Silicon Oasis. The very slow review process required by the European Union for such ventures has also been cited as a reason for investors getting cold feet.
MetroPhotonics partners with Mitsubishi
MetroPhotonics, a developer of photonic integrated circuits for access, metro and long-haul networks, has begun a partnership with Mitsubishi Corporation to distribute MetroPhotonics InP-based SurePath product portfolio in Japan and elsewhere.
"Given the steady growth of the optical networking industry in Japan, particularly with fiber-to-the-home buildouts, we are pleased to be distributing MetroPhotonics industry-leading line of photonic integrated circuits," said Nobuharu Murotani, general manager, Mitsubishi Corporation.
The partnership gives Mitsubishi exclusive rights in Japan, with non-exclusive distribution rights elsewhere. The SurePath products include a 43-channel optical power monitor, a 40-channel equalizer, and a 4-channel variable multiplexer and demultiplexer.
Soitec and Seika form JV company
Silicon- on-insulator (SOI) wafer manufacturer Soitec is to enter into an agreement with Seika Corporation, its longtime distribution partner in Japan, to form a joint venture.
The JV company will be headquartered in Tokyo, Japan, and will provide Soitec’s Unibond and Smart Cut SOI wafers, and other engineered substrates manufactured using Soitec s Smart Cut technology, to the Japanese marketplace via a full direct sales and support organization. The company will also serve the Korean and Chinese markets.
Under terms of the agreement, Soitec will acquire 70% interest in the Soitec Asian JV, while Seika Corporation will retain 30% ownership of the new entity. The transaction is expected to be finalized by April 1, 2004.
