Gatax launches W-CDMA handset PA chips
Gatax Technology, the Taiwan-based RFIC design house, is to start volume production of chips for power amplifier (PA) modules used in W-CDMA cell phone handsets.
According to a report at Digitimes.com, the company, which already makes a number of PA products for wireless LAN (WLAN) applications, says that the third-generation PA modules will enter volume production in either late 2004 or early 2005.
RF chips used in the modules will be based on an InGaP/GaAs HBT process, and the modules will be suitable for use in phones using the third-generation partnership project (3GPP) W-CDMA network.
The report adds that the company is planning to launch a new RFIC for the 802.11g WLAN protocol in September, as well as a MMIC for dual band 802.11a/g PA modules later in the year.
Gatax president Chi-yi Ho reportedly said that the company is currently shipping more than 100,000 of its existing WLAN chips to domestic customers per month, and that it is preparing to develop a new RFIC for the proposed 802.11n WLAN standard, which is aiming to provide 200 Mb/s connectivity.
