Product showcase
The TechCut 4 is a precision low speed saw excellent for cutting smaller, delicate samples that cannot tolerate excessive friction and heat caused by high speed sectioning. The gravity-fed cutting system uses adjustable weights to apply or counterbalance downward force to the sample during sectioning. With a 3-6 inch blade range, samples up to 2 inches can be sectioned. Features include: Touch pad switches control all functions; Variable speed with LED: 10-500 rpm (10 rpm increments); Micrometer sample indexing, 1 µm resolution; Corrosion-resistant aluminum & stainless steel construction.
Allied High Tech Products Inc
Contact Gary Liechty
Tel. +1 310 635 2466
Fax +1 310 762 6808
Email gdliechty@alliedhightech.com
Web www.alliedhightech.com
InP Etching Solutions
Unaxis introduces InP dry etching solutions spanning R&D projects from prototype fabrication to volume production. Systems can be configured with either RIE or ICP process technology on manual or automated wafer handling platforms. Reproducible, uniform thermal coupling between the substrate and a heated recirculating fluid electrode is accomplished with mechanical or electrostatic clamping and flow backside helium. Processes developed on entry level Unaxis systems are easily transferred to production platforms with features that increase maintenance intervals and improve cost-of-ownership. Whether shallow or deep etching, frontside features or backside vias, Unaxis has a hardware and process solution to meet your application needs.
Unaxis Semiconductors
Contact Notker Kling
Tel. +1 727 577 4999
Email notker.kling@unaxis.com
Web www.semiconductors.unaxis.com
Double Doping Cluster Source
The use of the Double Doping Cluster Source on one 4.5 inch flange increases the capacity of your MBE system (e.g. GEN II) by only needing a single port for Be and Si doping. Each cell has a conical 5 ccm PBN crucible. After melting the source material in an upwards position, the doping source can even be used in downward ports. A water-cooled shielding between the single cells reduces their thermal interaction. Cross contamination is minimized by the use of individual shutters separated by a Ta shielding.
MBE Components
Contact Dr. Eberl MBE-Komponenten GmbH
Tel. +49 7033 6937 0
Fax +49 7033 6937 20
Email sales@mbe-components.com
Web www.mbe-components.com
MicroLine 500
The MicroLine 500 automatically performs critical dimension measurements on cassettes of wafers. The system employs an auto-loading robot, pre-aligner and motorized positioning stage along with pattern-recognition software to load, align, and measure wafers without operator intervention. It provides measurement accuracy of 0.01 micron with 4 nm (one Sigma) repeatability. The system includes an extremely flexible, proprietary programming language (MCL) that offers the user full control of the system s functionality.
Micro-Metric Inc
Contact Micro-Metric Inc
Tel. +1 408 452 8505
Fax +1 408 452 8412
Email info@micro-metric.com
Web www.micro-metric.com
Hall Effect Measurement Systems
The new 7600/7700 series are the most sophisticated electronic transport measurement systems available. Hall coefficient, voltage, carrier density etc, measurements can be made on samples with resistances from 0.1 mΩ to 80 GΩ, in fields to 2 tesla and temperatures from 15K to 800K. Options including multiple contact I-V measurements, 4-sample or 6 inch wafer capability, and QMSA software (extracts the mobility and concentration of each carrier species in multi-layer materials) are available.
Lake Shore Cryotronics Inc
Contact Lake Shore Cryotronics Inc
Tel. +1 614 891 2244
Fax +1 614 818 1600
Email sales@lakeshore.com
Web www.lakeshore.com
C2 Optical Surface Analyzer
Candela Instruments C2 Optical Surface Analyzer offers fully automated surface inspection for 2 inch to 8 inch optoelectronic or semiconductor wafers. C2 combines scatterometry, reflectometry, ellipsometry and optical profilometry to measure reflectivity and topographic variations across the entire wafer surface. Applications include: Defect Detection and Classification (particles, stains, pits, bumps, and scratches); Film Thickness Uniformity; and Surface Roughness measurements.
Candela Instruments
Contact Gale Lane
Tel. +1 510 413 0900
Email query@candela-inst.com
Web www.candela-inst.com
