Packaging is the key for mm-wave MMICs
As GaAs MMIC manufacturers try to penetrate high-volume applications at millimeter-wave frequencies, packaging has emerged as the crucial issue.
That s according to the new report, Commercial Applications for Millimeter-Wave MMICs.
Replicating the success of MMIC technology for cell phone applications in the millimeter-wave spectrum is a critical strategy for GaAs device suppliers aiming to improve margins.
The report explores the technologies now being investigated by researchers, designers and manufacturers to deliver millimeter-wave solutions with the required performance and at the low cost demanded by potential high-volume customers.
According to the report s authors, Jeff Powell and Dave Bannister of QinetiQ, MMIC manufacturers could introduce price structures that would enable significant rate reductions for bulk orders, even with existing chip designs. But the big problem remains the cost of packaging, which means that complete millimeter-wave MMICs can be five to six times more expensive than the bare die.
As well as a detailed analysis of potential packaging solutions and emerging device technologies, the report provides a comprehensive review of potential commercial applications for millimeter-wave MMICs.
Commercial Applications for Millimeter-Wave MMICs is published by Technology Tracking, a partnership between QinetiQ, Europe s largest science and technology organization, and Institute of Physics Publishing, the publisher of Compound Semiconductor magazine.
For more information visit Technology Tracking, or contact Jenny Brown (tel. +44 (0)117 930 1034; email jenny.brown@iop.org).
