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In brief: Osram, MGM, Silicon Labs and Endwave

Osram licenses its white LED technology to Lednium, MGM Studios prepares to launch films in Blu-ray format, Silicon Labs releases a CMOS power amplifier for cellular applications, and Loea selects Endwave for the production of transmit and receive modules for its gigabit-per-second radio.
Osram signs licensing agreement
Osram has licensed its white LED technology to Lednium, an Australia-based manufacturer of multi-chip dome-shaped LED lamps.

The agreement allows Lednium to use white LEDs containing blue-emitting InGaN chips and a phosphor converter.

MGM to launch Blu-ray films
Film maker Metro-Goldwyn-Mayer (MGM) says that it plans to release film and television titles from its library in Blu-ray format when the associated hardware is launched in North America, Japan, and Europe.

"Blu-ray technology, with its expanded storage capacity and increased interactive capabilities, allows us to continue to provide our customers with the best movie experience available," said Harry Sloan, CEO of MGM Studios.

Silicon Labs unveils CMOS amplifier
Integrated circuit designer Silicon Laboratories has added the Si4300T, a triband power amplifier (PA) for GSM/GPRS cellular applications, to its family of monolithic CMOS PAs.

According to Silicon Labs, the Si4300T, which will be manufactured in volume from the first quarter of 2006, uses a single die and integrates all the functions between the transceiver and the antennae switch module.

"Historically, power amplifiers have had the highest failure rates in the cellular handset," remarked Dan Rabinovitsj, vice president of Silicon Labs. "We designed the Si4300 family to deliver dramatic improvements in PA reliability when compared with competing solutions."

Loea selects Endwave components for gigabit radio
Loea, a producer of gigabit-per-second wireless communication systems, has selected Endwave to develop the transmitter and receiver modules that perform the frequency conversion functions within its radio.

Endwave says that it will incorporate into the modules its low-cost Epsilon packaging technology, which is based on injection molded metallized plastics.

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