Semiconductor materials contracted for 2009
The global semiconductor materials market contracted 19 percent in 2009 compared to 2008 as the semiconductor industry reacted quickly to deteriorating market conditions in the first part of the year. While the decline in 2009 was significant, it was less than the 26 percent decline the semiconductor materials industry incurred in 2001.
Semiconductor materials market revenues totalled $34.6 billion globally in 2009. Total wafer fabrication materials and packaging materials were $17.9 billion and $16.8 billion, respectively. Comparable revenues for these segments in 2008 were $24.2 billion for wafer fabrication materials and $18.3 billion for packaging materials. Significant decreases in silicon revenues contributed to the year-over-year decline in the wafer fabrication materials market.
Japan remains the largest consumer of semiconductor materials with a 22 percent share due to its large wafer fab and advanced packaging base. All regional markets experienced double-digit declines with the exception of China, which contracted about 9 percent. Increases in gold metal pricing helped to offset declines in regions with strong packaging bases. (The ROW region is defined as Singapore, Malaysia, Philippines, other areas of Southeast Asia and smaller global markets).
2008-2009 Semiconductor Materials Market by World Region
(Dollar in U.S. billions; Percentage Year-over-Year)
|
|
2008 |
2009 |
% Change |
|
Japan |
9.96 |
7.63 |
-23.4 |
|
Taiwan |
7.87 |
6.77 |
-14.0 |
|
Rest of World |
6.90 |
5.98 |
-13.3 |
|
South Korea |
5.90 |
4.69 |
-20.5 |
|
North America |
4.99 |
3.79 |
-24.1 |
|
China |
3.57 |
3.26 |
-8.7 |
|
Europe |
3.32 |
2.52 |
-24.1 |
|
Total |
42.51 |
34.63 |
-18.5 |
