3S PHOTONICS Accelerates the Green Revolution
The need for optical amplification is increasing in next generation optical networks. Metro or core amplification of D-WDM signals is a major contributor to overall power consumption in today’s optical networks. The evolving need for amplification of single channels in FTTx and high speed 40 or 100Gb/s transponder applications using conventional pumping has a significant and detrimental effect on systems’ power consumption, reliability and cost. The latest evolution of the class-leading pump laser portfolio from 3S PHOTONICS is designed to minimize power consumption, cost and reliability concerns.
The need for absolute reliability using commercially available chips requires significant cooling of the chip to be provided. The resulting power demands and heat dissipation have a major impact on the design, operation and cost of optical amplification systems. Utilizing in-house “state of the art” laser chips and class-leading alignment technology, 3S PHOTONICS offers the most efficient range of pump laser modules on the market today.
Whether it is EDFA or Raman amplification, the class-leading reliability of the 3S PHOTONICS pump laser chips enables either very high optical output or significantly reduced cooling, whichever is the design priority. The ultimate result is the lowest initial and operating cost/Bit of transmitted data.
The complete product range includes conventionally cooled, 45°C cooled or un-cooled pump laser modules. The 1999 HPM and 1999 CHP Series are conventionally cooled devices with operating power up to 430 and 720mW respectively. These versions use up to 20% less power compared to competing solutions and are a straightforward drop-in replacement. The 1999 HEP is a 45°C cooled product with operating power up to 450mW which requires up to 50% less power to operate. For the greatest savings of all, the 1999 HPU provides operating power up 400mW and an 80% reduction in power consumption.
These savings have been achieved through the incorporation of the submarine qualified 1999 LCv2 laser chip which is produced at the 3S PHOTONICS facility in Nozay, France. With a hermetically sealed, 14-pin Butterfly or Mini-DIL package, and Fiber Bragg Grating (FBG) stabilization integrated into the fibre pigtail, all products provide stable performance over a wide dynamic range. All modules are qualified to Telcordia GR-468-CORE and provide the lowest failure in time (FIT) rates in the industry.
The whole range of 3S PHOTONICS’ pump lasers have been designed to be easily integrated into both old and new amplifier platforms with minimum re-engineering required.
“If you look at the growing demand for sustainable energy usage and continuous cost reduction pressures in all industry sectors, power consumption reductions up to 80% will help contribute to the Green Revolution that is required in the telecom sector” said Yannick Bailly, Vice-President of Marketing and Product Lines Management at 3S PHOTONICS. “In addition, the significant Capex and Opex reductions demonstrate a true “win-win” for both the environment and business.
About 3S PHOTONICS
3S PHOTONICS – formerly Alcatel Optronics – is the leading world manufacturer of laser chips, optical discrete modules and components for undersea telecommunication networks. It designs, develops, manufactures and commercializes active components powered by in-house III-V optoelectronic chips based on both Gallium Arsenide (GaAs) and Indium Phosphide (InP) technologies and passive components using Fiber Bragg Gratings (FBG).
The 3S PHOTONICS renowned optoelectronic chip manufacturing plant of Nozay is a technological feat that is unique in the world as it brings together GaAs and InP technologies under the same roof.
Its product portfolio includes five product lines:
* Transmission Laser and Detector Modules
* Pump Laser Modules for terrestrial and submarine applications
* Chromatic Dispersion Compensation Modules
* Filters, gain equalizers and pump stabilizers based on Fiber Bragg Gratings for terrestrial and submarine applications
* Chips (lasers and detectors) and Front End Services
