News Article
Oxford’s new Plasma tool can do all sorts
PlasmaPro NGP 80 offers RIE, PECVD, ICP & RIE/PE for III-V etch processes suited to R&D and small-scale production.
Oxford Instruments has just launched its PlasmaPro NGP80 system. A compact open-loading tool, the PlasmaPro NGP80 offers versatile plasma etch and deposition solutions on one platform with convenient open loading. With a small footprint, the easy to use multiple process technology configuration does not compromise on process quality.
The PlasmaPro NGP80 is ideally suited to R&D or small-scale production, and can process from the smallest wafer pieces to 200mm wafers. The open load design allows fast wafer loading and unloading, ideal for research, prototyping and low-volume production.
Other key features of the system are the latest generation BUS control system, that greatly increases data retrieval and delivers faster and more repeatable matching, and the clear ease of access to key components for improved servicing and maintenance.
The multiple configurations on offer, RIE, PECVD, ICP & RIE/PE mean that NGP80 can be used in a wide range of applications, including III-V etch processes, Silicon Bosch and cryo-etch processes, Diamond Like Carbon (DLC) deposition, SiO2 and quartz etch, hard mask deposition and etch for high brightness LED production and many more.
The Nanoscale Physics Research Laboratory at Birmingham University has been trialing the NGP80 for over a year, using the tool to research the development of new photo-resists for next generation lithography, and the fabrication of high aspect ratio silicon based field emitters.
Alex Robinson, heading the research commented, "The Plasmapro NGP80 has significantly enhanced our etching capabilities. The new software is very simple to learn, but allows considerable flexibility to build complex processes.”
He added, “Excellent repeatability together with comprehensive parameter logging have enabled a rapid transfer of previously developed fabrication steps to the new machine, consolidating work previously done on several different etchers, whilst the flexibility and ease of use have allowed us to develop our research in new directions."
The equipment was purchased through the AM1 project “Creating and Characterizing Next Generation of Advanced Materials”. The project is part of a major investment in research infrastructure funded by Advantage West Midlands and the European Regional Development Fund (ERDF) under the wider Birmingham Science City initiative. The investment has united the Universities of Birmingham and Warwick in a newly formed Science City Research Alliance to advance innovation within the region.
Sales Director for OIPT, Mark Vosloo, says the launch is extremely positive for both OIPT and its customers, “As a company we are committed to constant product innovation in order to offer our customers the latest process techniques and systems in etch, deposition and growth.”
He also said that the NGP80 has been developed to allow faster throughput, and greater repeatability at a reduced cost to the customer and added, “ With such successful trials at Birmingham University now complete, we are confident that our customers will find the PlasmaPro NGP80, Next Generation Plasma tool is living up to its name.”
