News Article
Avago’s Optical Transceiver Increase Port Density by 30%
The firm says its new Mini-SFP+ Line offers industry’s smallest form factor for 10-Gbps pluggable modules for ethernet equipment.
Avago Technologies unveiled a new form factor for fiber-optic transceivers that enables increased port density in ethernet and storage equipment at the Super Computing 2010 conference.
The new mini-SFP+ (mSFP+) pluggable modules enable 30 % greater port density over industry-standard SFP+ transceivers, while delivering the same data-transmission performance for next-generation 10-Gbps Ethernet equipment designs and 8-Gbps Fibre Channel for storage applications.
The new mSFP+ transceivers incorporate Avago 850-nm Vertical-Cavity Surface Emitting Laser (VCSEL) and PIN detector technology and comply with the optical interface specification per IEEE 802.3ae 10GBASE-SR standards.
The devices are designed for low power consumption with typical dissipation of 0.6W. Avago has teamed with multiple cage and cable suppliers to provide a complete 10-Gbps Ethernet mSFP+ solution. Avago is exhibiting a high-density DCX Backbone modular switch from Brocade featuring the mSFP+ technology, in addition to demonstrating other high-speed optical fiber solutions, at the Super Computing 2010 conference in booth number 1328 at the Ernest N. Morial Convention Center from November 15-19.
“Avago is the market leader in 8- and 10-Gbps SFP+ transceivers, and our new mini-SFP+ devices integrate our proven technology in an innovative form factor that helps our world-class networking customers such as Brocade to deliver higher density networking equipment,” said Tina Ohlhaver, marketing manager for fiber optic products at Avago. “Avago optical transceivers offer unparalleled reliability, with not a single VCSEL failure in the millions of 8- and 10-Gbps modules we have shipped to date.”
Avago Technologies is a leading supplier of analog interface components for communications, industrial and consumer applications. By leveraging its core competencies in III-V compound and silicon semiconductor design and processing, the company provides an extensive range of analog, mixed signal and optoelectronics components and subsystems to approximately 40,000 end customers.
