Engineered Substrates for future compound semiconductor devices
CS Europe conference takes place 22nd March 2011, Hilton, Frankfurt and focuses on “What next for the Compound Semiconductor Industry?” Book now at www.CSEurope.net · What next for the Compound Semiconductor Industry - presented at CSEurope conference by Klaus H. Ploog, Pioneer of Molecular Beam Epitaxy (MBE) · Role of GaN RF Power Technology for Tomorrow's Commercial and Defence Wireless Applications - presented at CSEurope conference by Jeff Shealy, Division Vice President, RFMD · How to make a state-of-the-art visible red laser, what its specs are, and what new markets it can target - presented at CSEurope conference by Dr. Petteri Uusimaa, President, Modulight · The urgency for the world to make power grids digital (smart grids) and photovoltaic developments for electricity production from solar - presented at CSEurope conference by Jan-Gustav Werthen, Senior Director, Photovoltaics, JDSU · 3G/4G requirements for wireless systems and the role GaAs and GaN devices will play in meeting these requirements - presented at CSEurope conference by Dr Otto Berger, Corporate Advanced Technology Director, TriQuint Semiconductor, Inc · What's needed from GaAs and GaN for tomorrow's wireless - presented at CSEurope conference by Marc Rocchi, CEO, OMMIC · Recent Progress on Green InGaN Laser Diode Development at OSRAM Opto Semiconductors - presented at CSEurope conference by Alexander Bachmann, Marketing Engineer, OSRAM Opto Semiconductors GmbH · What are the success factors for the deployment of Solid State Lighting? - presented at CSEurope conference by Dr. Michael Fiebig, Director Marketing and Business Development Solid State Lighting, OSRAM Opto Semiconductors GmbH · How will SiC power devices help getting a greener planet - presented at CSEurope conference by Mats Reimark, CEO, TranSiC · SiC Advances for Power Electronic Applications - presented at CSEurope conference by Dr. Markus Behet, Europe Business Development Manager, Dow Corning Compound Semiconductor · Future Proofing Networks with 100 Gigabit Optics - presented at CSEurope conference by Scott Parker, Executive Vice President Sales and Marcom, Oclaro, Inc · High performance compound semiconductors for infrastructure, automotive and defence applications - presented at CSEurope conference by Dr. Ulf Meiners, Chief Technical Officer, UMS and Mark Murphy, Director Marketing, RF Power & Base, NXP · Batch and single wafer processing strategies for HBLEDs - presented at CSEurope conference by Dr Mike Cooke, Chief Technology Officer, Oxford Instruments Plasma Technology · GaN power electronics: Market forecasts and industry status - presented at CSEurope conference by Dr. Philippe ROUSSEL, Project manager Power Electronics and Compound Semiconductors, Yole Développement · Efficient High-Voltage GaN Devices and ICs for Next Generation Power Management Solutions - presented at CSEurope conference by Dr. Ertugrul Sönmez, Business Development, MicroGaN GmbH · Standardisation in compound semiconductors - an essential step for furthering the efficiency & profitability of the industry. - presented at CSEurope conference by Roy Blunt, SEMI International Compound Standards · GaN - meeting emissions regulations - presented at CSEurope conference by Mike Czerniak, Product Marketing Manager, Exhaust Gas Management, Edwards · Engineered Substrates for future compound semiconductor devices presented at CSEurope conference by Dr. Thomas Uhrmann, Business Development Manager, EV Group (EVG) CSEurope web site: www.CSEurope.net Delegate booking: http://www.cseurope.net/register.php Contact: info@cseurope.net
