News Article

RFMD PowerSmart Power Platforms Achieve 4G Performance

The power platforms achieved HSPA+ 4G data upload speeds while drawing approximately 15% less current than competitive solutions.

RF Micro Devices (RFMD), a designer and manufacturer of high-performance radio frequency components and compound semiconductor technologies, has achieved a major performance milestone related to its PowerSmart power platforms.

RFMD's PowerSmart power platforms are a new product category reshaping the future of multimode, multi-band cellular RF architectures.

During independent product testing, the PowerSmart power platforms achieved HSPA+ 4G data upload speeds while drawing approximately 15% less current than competitive solutions. Product qualification tests, which are routinely performed to evaluate each new cellular product's front end, transceiver and baseband, are currently being conducted in support of a highly anticipated product family spanning multiple form factors, to be launched by a leading cellular device manufacturer beginning in the March, 2011, quarter.

PowerSmart power platforms feature a revolutionary new RF Configurable Power Core that delivers multiband, multi-mode coverage of all cellular communications modulation schemes, including GSM/GPRS, EDGE, EDGE Evolution, CDMA, 3G (TD-SCDMA or WCDMA) and 4G (HSPA+, LTE or WiMAX).

HSPA+ 4G devices are capable of maximum data upload speeds of 22 megabits per second (Mbps). Because the RF Configurable Power Core in PowerSmart is compliant with all current and known future 4G data standards (HSPA+, LTE QPSK, LTE 16QAM, and LTE 64QAM), RFMD anticipates subsequent smartphones featuring PowerSmart will support upload speeds significantly greater than 22 Mbps.

In addition to the RF Configurable Power Core, which performs all power amplification and power management functionality, RFMD's PowerSmart power platforms include all necessary switching and signal conditioning functionality in a compact reference design, providing smartphone manufacturers a single scalable source for the entire cellular front end.

RFMD designs and manufactures high-performance semiconductor components which enable worldwide mobility, provide enhanced connectivity and support advanced functionality in the cellular handset, wireless infrastructure, wireless local area network (WLAN), CATV/broadband and aerospace and defense markets. The firm is headquartered in Greensboro, N.C.
CS International to return to Brussels – bigger and better than ever!


The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.


Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email info@csinternational.net  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!

Register


×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
Live Event