Technical Insight
TriQuint's WEDGE portfolio 'extends talk-time for 3G mobile phones'
Kevin Schoenrock, product marketing manager for TriQuint, explains how two GaAs processes within its TQBiHEMT reduces part count and saves board space.
TriQuint Semiconductor has revealed a new radio frequency (RF) front-end solution just a week away from the GSMA Mobile World Congress in Barcelona.
Its new solution for Qualcomm s 3G chipset solutions include the TRITON PA Module family for wideband code division multiple access (WCDMA) and the HADRON II PA Module for enhanced data rate (EDGE) for GSM evolution the TQM7M5013.
The solution is ideal for next-generation smartphones, netbooks and data cards and is optimised for superior current consumption. The TRITON PA Module family is also capable of multi-mode operation and covers all major 3G partnership project WCDMA bands.
Kevin Schoenrock, product marketing manager for TriQuint, said: "Superior current consumption is achieved via state-of-the-art processes - BiHEMT and CuFlip - coupled with a unique design approach. This is important for extending talk-time in 3G phones."
As well as superior current consumption, the WEDGE portfolio uses discreet components to enable the industry s smallest footprint, it claims. This helps TriQuint to meet market demand for discrete WCDMA amplifiers, which in turn is driven by the rising number of frequency bands per wireless device.
TriQuint Semiconductor believes it can address the rapidly growing market segments such as smartphones because its technology provides a complete RF front-end solution for all of the leading 3G chipset providers. As such, adoption of its products will increase during the second half of 2010.
"Initial customer pull is very strong and we have design-ins at several leading handset makers already. The largest market is 3G WEDGE handsets; the WCDMA portion of the phone previously unserved by TriQuint, but where we are a market share leader in the EDGE portion. We will differentiate ourselves from the competition via technology leading to best-in-class performance," Mr Schoenrock said.
The CuFlip, Copper Flip and TQBiHEMT technologies are included within the TRITON family and together provide the size, efficiency and performance which are required.
In particular, the TQBiHEMT enables two gallium arsenide (GaAs) processes to be integrated on to a single die, saving board space and reducing part count.
As Mr Schoenrock explained, a single die reduces the cost of the module and improves performance by preventing die-to-die parasitics. By reducing external components and integrating the regulator and coupling functions, board space is saved.
This was previously solved by using several, external, discrete components.
With this latest solution, TriQuint could be well positioned to take advantage of predicted WCDMA growth. Qualcomm s Quarterly Regional CDMA Based Device Shipment Estimates noted that WCMDA will grow by 28 per cent from 2009 to 2010.
Indeed, the fastest growing communications standard saw 17 per cent growth from 2008-09, which could open up the opportunities which TriQuint to extend its grasp on the market.
The increased network demand which comes from smartphones can also be met by TriQuint Semiconductor through its portfolio of 3G/4G wireless base station RFICs. It recently stated that its expertise of GaAs and gallium nitride technologies means its heterojunction bipolar transistor devices are the best choice for high-power base station applications.
