Interplex Introduces New Solar Cell Receiver Package
The package design incorporates the Interplex unique, patented, Dual Lead-frame Design which integrates a thick copper base (heat sink) with a standard lead-frame structure in a high temperature LCP Thermoplastic enclosure. This ensures excellent heat transfer from cell to heat sink via the copper leadframe in order to support increased cell efficiency. The design of the package allows for flexible secondary optics mounting, suiting the varied and different module designs that CPV system manufacturers are now considering. It is also designed to have inexpensive interconnect spade terminals for low cost integration of cell systems enabling a lower total cost of assembled receiver due to simplified assembly operations.
These packages offer significant advantages compared to the alternative methods of component assembly utilizing Direct Bond Copper (DBC) ceramic substrates or Insulated Metal substrates (IMS). Thermal management is built in, secondary optics are easily mounted and isolation between cell and system housing can be achieved very simply with a variety of materials. Furthermore, a packaged cell device allows easier and safer handling, quicker assembly and test of the system as well as simpler repair and replacement, making the designs more future proof as better cell designs and efficiencies are developed.
“IEP’s solar cell package design is one of the first available that offers a user friendly solution for the component user as well as the device supplier,” said Andy Longford, IEP’s technical support consultant for Europe. Mr. Longford is also the chair of the European SEMI Advanced Packaging Committee. “This unique package development offers manufacturers and users of Photosensing and power LED devices a robust, thermally-enhanced housing for their components coupled with simple interface connectors. This is an ideal, low cost option for both sample testing and production applications.”
The packages are available as detailed or can be easily customized to suit different interconnections, optics or component sizes.
