News Article
M/A-COM Technology Solutions Introduces 38 GHz Packaged Chipset
The firm’s latest chipset includes integrated up converter and receiver, driver and power amplifiers, VCO and multiplier and will be used by the point-to-point radio market.
M/A-COM Technology Solutions introduced at European Microwave Week (EuMW) a 38 GHz surface mount technology (SMT) packaged GaAs MMIC chipset solution for the point-to-point (PtP) radio market. This 38 GHz chipset includes an integrated up converter and receiver, driver and power amplifiers, a VCO and a multiplier.
The devices that comprise this chipset offer unique selling features. The XB1014-QT driver amplifier and XP1080-QU power amplifier with integrated detector on-chip deliver exceptional linearity performance. Integrated on a single SMT chip, the XR1008-QB receiver includes a low noise amplifier (LNA) that provides optimum noise performance, an image reject mixer with high linearity performance, an LO driver amplifier and a frequency doubler for the LO input.
The XU1019-QH up converter includes a mixer, RF buffer, LO buffer, and LO doubler. The MAOC-009264 VCO achieves low phase noise performance and exhibits low performance variation over temperature. The XX1000-QT multiplier combines an active doubler with an output buffer amplifier to deliver constant power over a range of input powers. The table below outlines specific part number performance:
"M/A-COM Tech's 38 GHz chipset solution provides high performance devices that combine to lower costs, reduce design time and improve time to market for our customers," said David Richardson, Market Director, PtP products. "The recent merger of M/A-COM Tech and Mimix Broadband, combined with M/A-COM Tech's new line of VCOs enable us to provide enhanced chipset solutions for 38 GHz as well as all the major PtP radio bands," added Jack Redus, Product Manager.
Engineering samples, sample boards and production devices for these devices are available today from stock
M/A-COM Tech and Mimix Broadband recently announced the completion of the merger of their corporate parents.
