News Article
Entegris Wafer Shipper Enhances LED Manufacturing
The Ultrapak100 is designed to reduce damage and contamination to protect thin substrates used in LED manufacturing and other applications.
Entegris has introduced a wafer shipper that specifically meets the critical handling needs of compound semiconductor and thin silicon wafers.
The Ultrapak 100 mm thin wafer shipper is designed to reduce damage and contamination in order to better protect thin substrates used in LED manufacturing and other applications. The new product is being showcased with other LED solutions at the Company's booth at the SEMICON Korea 2011 tradeshow being held in Seoul, Korea on January 26, 2011.
Currently, the LED industry predominantly uses shippers designed for silicon semiconductor applications. These wafer shippers are not designed for compound semiconductor or thin silicon shipment and can cause wafer damage or breakage, cross-slotting and particle generation via rotation if used in these sensitive applications.
Entegris’ latest thin wafer shipper offers several design features that help silicon and compound semiconductor manufacturers reduce these risks, including cradle strap support (upper and lower cushions) of the wafer that limits wafer rotation. This ensures reduced particle contamination, and secures the wafers in the cassette to safeguard against breakage.
The tool also has enhanced perimeter support of the substrate to reduce stress levels during impact events during transport. The ultrapure polypropylene provides a clean shipping environment and assures low levels of outgassing to prevent haze or changes to the wafer surface.
Robotic pickup flanges on the cassette allow convenient handling and the centre notch track alignment and an "H" bar help ensure accurate equipment interoperability for both vertical and horizontal wafer transfers. Secondary packaging design holds eight shippers at a time, helping protect up to 200 wafers.
The Ultrapak 100 mm shipper has successfully passed the ISTA-2A procedure for free-fall drop with 150 micron thick germanium wafers using Entegris' designed secondary packaging. It has also passed a battery of other functional tests using 300, 200, and 150 micron thick wafers.
