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TriQuint Multi-Mode PA Powers Qualcomm’s 3G/4G Chipset

The GaAs based power amplifier (PA) improves performance and lowers WCDMA and EDGE system cost in mobile devices.

TriQuint Semiconductor, an RF front-end product manufacturer and foundry services provider, has announced the availability of its first Multi-Mode Power Amplifier (MMPA) module developed for Qualcomm’s 3G/4G chipset solution.

The TQM7M9023, a member of the TRIUMF Module family, combines with TriQuint’s TRITIUM PA-Duplexer Module family to offer a complete RF system solution for smartphones and other mobile devices.

 



Tim Dunn, VP and General Manager of Mobile Devices at TriQuint noted, “The TQM7M9023 is an important addition to our product portfolio.  It integrates WCDMA functionality around our core competence of GSM/EDGE power amplifiers while providing customers a flexible, high performance platform solution to meet the increasing band count combinations in 3G/4G handsets. Our ability to integrate passive and active devices into high performance system solutions continues to propel TriQuint’s value in the smartphone market.”

TriQuint says its MMPAs provide several key benefits to mobile device vendors, in particular, decreased overall radio solution size to enable a greater feature set in a smaller form factor. It has also simplified PCB routing for improved performance and design cycles and a reduction in BOM count that improves manufacturing efficiency.

The combination of the MMPA and Band 2 and Band 5 TRITIUM modules offers a flexible and simplified RF solution that can reduce mobile device engineering and development time.

TriQuint will highlight these platform solutions at the telecommunications industry’s largest annual gathering, GSMA Mobile World Congress, in Barcelona, Spain 14 - 17 February, 2011.

The firm’s CuFlip technology enables a compact 5.0 x 7.5mm footprint in the TQM7M9023. The MMPA integrates Quad-band GSM/EDGE functionality with WCDMA Bands 1 & 8 into a single package. Building on TriQuint’s leadership in the EDGE market, the MMPA can provide improved system performance and lower overall cost by replacing three discrete power amplifier modules and associated matching components.

The TQM7M9023 is a fully integrated MMPA and includes a GSM/EDGE power amplifier, WCDMA power amplifiers, high performance coupler, regulatory circuitry and matching components.  It does not require an external DC/DC converter or complicated band switches, thus providing customers the best RF performance at maximum output and backed-off power levels for both data and voice applications, respectively.

The TQM7M9023 is now sampling and is expected to ramp into production by mid 2011.

The Band 2 TQM61605x and Band 5 TQM66605x TRITIUM PA Duplexers were designed to support the MMPA.  TriQuint integrates high-performance BAW and SAW duplexer capabilities with low current consumption power amplifiers to customize traditional components for optimal performance.

The latest TRITIUM PA-Duplexers are approximately 50% smaller in size compared to the TRITIUM family that shipped over 200 million units in 2010. The modules allow multi-mode CDMA and WCDMA operation, enabling customers to leverage a single product across multiple platforms.

Each module contains a Flip Chip BiHEMT power amplifier die, achieving current consumption for maximum talk-time and thermal efficiency critical for smartphone applications. The new TRITIUM PA-Duplexers will be sampling in the second half of 2011. 

 
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