News Article
Positive vibes reverberate through CS Europe
Compound semiconductor lasers and memories for making data communications greener, green laser pointers for picoprojectors and more advanced GaAs chips for tomorrow’s smart phones were all discussed at CS Europe.
On 22 March 150 delegates from around the globe flocked to Frankfurt, Germany, to attend CS Europe and capture an overview of the state of the compound semiconductor industry and find out where it is heading.
During this one-day meeting those attending could pick and choose from 18 talks that covered the broad spectrum of manufacturing activities occurring in the compound semiconductor industry.
Key note speaker for the event was the legendary MBE trailblazer Klaus Ploog, who reminded the audience of some of the hurdles that confront the industry – including the low efficiency of LEDs in the green, and droop that plagues nitride devices at high currents – plus opportunities in certain areas, including exotic compound semiconductor materials for memory.
The other speakers who spoke that day were:
Jeff Shealy, Division Vice President of RFMD who described the role of GaN RF Power Technology for tomorrow's commercial and defense wireless applications
Modulight’s president, Petteri Uusimaa, who explained how to make a state-of-the-art visible red laser, what its characteristics are, and what applications it can serve
Jan-Gustav Werthen, Senior Director,Photovoltaics at JDSU, who explained why there is an urgency for the world to make power grids digital (smart grids) and also described photovoltaic developments for electricity production from solar
Otto Berger, Corporate Advanced Technology Director of TriQuint Semiconductor, who detailed 3G/4G requirements for wireless systems and the role GaAs and GaN devices will play in meeting them
OMMIC’s CEO, Marc Rocchi, who gave his take on what's needed from GaAs and GaN for tomorrow's wireless
Alexander Bachmann, Marketing Engineer from OSRAM Opto Semiconductors, who outlined the company’s recent progress on green InGaN laser diode development
Christian Gartner, senior product engineer at OSRAM Opto Semiconductors, who considered the success factors for the deployment of solid state lighting
Markus Behet, Europe Business Development Manager, Dow Corning Compound Semiconductor, who discussed SiC advances for power electronic applications
Ulf Meiners, Chief Technical Officer, UMS and Mark Murphy, Director Marketing, RF Power & Base, NXP, who talked about high-performance compound semiconductors for infrastructure, automotive and defense applications
Philippe Roussel, Project manager Power Electronics and Compound Semiconductors
Yole Développement, who described the status and outlook of the GaN power electronics market
Ertugrul Sönmez, who heads up business development at MicroGaN, who detailed the company’s high-voltage GaN Devices and ICs for next-generation power management
IQE’s Roy Blunt, who covered standardization issues in compound semiconductors, which are an essential step for furthering the efficiency & profitability of the industry
Mike Czerniak Product Marketing Manager, Exhaust Gas Management, Edwards, who spoke about the company’s technology for reducing GaN emissions in the fab
Thomas Uhrmann Business Development Manager at EV Group, who discussed the role of engineered substrates for future compound semiconductor devices
Ian McKinlay, Senior Product Manager at Oxford Instruments Plasma Technology, who compared Batch and single wafer processing strategies for HB LED manufacture
Mike Wale Director Active Products Research at Oclaro, who talked about 100G networks
Giles Chappell Associate from McKenna Long & Aldridge LLP, who described the steps needed to ensure compliance with the new RoHS Directive
A more comprehensive account of CS Europe will appear in the April &May edition of Compound Semiconductor magazine.
