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Wafer Bonding Report

Yole Développement announces the publication of its technology study and market research report, Permanent wafer bonding report

Historically developed for MEMS & SOI substrates, the wafer bonding technology is today becoming a key processing technology for a wide range of applications including LEDs, Power Devices, RF and Advanced Packaging.

The wafer bonding market is a very complex one crossing different wafer sizes (from 2’’ to 12’’), different applications (Advanced Substrates such as SOI, MEMS, LEDs, CMOS Image Sensors, Power Devices, RF Devices & Advanced Packaging) and different bonding technologies (Adhesive, Anodic, Fusion, Direct Oxide, Eutectic, Glass Frit, Metal Diffusion).

Yole Développement’s report aims at giving a vision, crossing what the wafer bonding technologies will be over the 2010-2016 time line.

Market Trends

Wafer bonding is usually defined as a process that temporarily or permanently joins two wafers or substrates using a suitable process. Historically developed for MEMS and then SOI wafers, wafer bonding technology has shifted to non-mainstream IC applications over the last years. Our report aims at analyzing the market perspectives and technical trends for permanent bonding.

Wafer bonder can be also used for LEDs or Power Devices. Indeed, in a typical LED active region, spontaneous emission scatters photons in all directions. If the substrate material has a smaller band gap than the active region, approximately half of the light is absorbed in the substrate; significantly reducing device performance. So, one of the manufacturing solutions for photon loss involves bonding a wafer containing an array of devices to another wafer that provides both a reflective surface for maximum light extraction and a heat sink for thermal management. And of course, over the 5 past years, much attention has been given to this technology for 3D integration of memories for example.

Technology Trends

Yole Développement has estimated the wafer bonder to have big market growth for the next year. The growth will be driven small size wafer for LEDs and 12” wafer for 3D stacking and CIS.

Although EV Group is market leader in permanent bonding, the growth of the bonding equipment market is attracting challengers.

Yole Développement’s report analyzes in details the technical & economical evolution of the permanent wafer bonding process. It gives, for example, 2010-2016 market forecasts for permanent bonding, number of equipment, an overview of the different bonding approaches and equipment players market shares and competitive information

This market & technology report also presents the trends for permanent bonding, W2W vs. C2W analysis for 3D integration. It describes the applications for wafer bonding with main characteristics, challenges

About Permanent Wafer Bonding Report:

•         Authors

Dr. Eric Mounier has a PhD in microelectronics from the INPG in Grenoble. Since 1998 he is a co-founder of Yole Développement, a market research company based in France.  At Yole Développement, Dr. Eric Mounier is in charge of market analysis for MEMS, equipment & material.

•         Catalogue price: Euros 3,990.00 (single user license) - Publication date: May 2011

For special offers and the price in dollars, please contact David Jourdan (jourdan@yole.fr or +33 472 83 01 90)

•         Companies cited in the report

Acreo, AML, APM/UMC, Avago, Ayumi, Bosch, Colibrys, Dalsa, Discera, EVGroup, FhG IMS, FLIR, IBM, Icemos, IMEC, IMT, Infineon, Infineon, Invensense, KTH, Leti, Lumileds, MEMStech, Micralyne, Mitsubishi Heavy Industries, Okmetic, Omron, Osram, Qualcomm, Raytheon, RPI, Sand9, Semefab, Sensonor, Silex, SOITEC, STM, SUSS MicroTEC, Tezzaron, TI, tMt, Tohoku University, TowerJazz, Tracit, Triquint, Tronic's, TSMC, VTI, Xcom, Ziptronix
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