Plasma-Therm welcomes order for VERSALINE system
The firm has received an order from a wireless compound semiconductor chip manufacturer which produces gallium arsenide and silicon nitride materials.
Plasma-Therm, a supplier of plasma process equipment, has sold another multi-chamber VERSALINE production system for etch and deposition to a leading North American wireless compound semiconductor manufacturer.
The process modules include an Inductively Coupled Plasma (ICP) etcher for additional capacity for advanced backside GaAs via formation. A second module utilises Plasma Enhanced Chemical Vapour Deposition (PECVD) for highly controllable, low damage, low stress SiN deposition for demanding applications such as capacitors and passivation.
Each process chamber includes Plasma-Therm’s EndPointWorks technology to ensure maximum via etch yield and real-time film thickness monitoring. These orders compliment an installed base of Plasma-Therm VERSALINE and Versalock equipment at this site.
“Plasma-Therm has been an integral equipment supplier for wireless chip manufacturers for many years. Repeat orders based on a history of reliable, superior performance affirm our abilities to providing outstanding solutions to challenging compound semiconductor manufacturing issues,” explains Ed Ostan, Senior VP of Marketing.
“Our wireless device manufacturing customers are attracted by the breadth and depth of our technology spanning etch and deposition processes and our collaborative efforts with customers to ensure maximum value.”