Brewer and SUSS to commercialise ZoneBOND process
Brewer Science, the inventor of ZoneBOND technology and expert in materials and processes for thin wafer handling, and SUSS MicroTec are joining forces in commercialising ZoneBOND technology for thin wafer handling.
SUSS MicroTec is now offering the Brewer Science ZoneBOND process on the XBC300 and XBS300 platforms, targeted for high volume bonding and debonding of 200/300mm wafers using silicon or glass carriers. Brewer Science offers products specifically designed for the successful implementation of its ZoneBOND process including materials for carrier preparation, adhesives, removers, as well as small scale debonding equipment. ZoneBOND technology is an innovative solution for wafer handling that provides excellent total thickness variation (TTV) control, high-temperature stability, and low-stress debonding. Customers will benefit through higher yield at debonding, higher throughput, and lower cost of ownership. This joint effort combines both companies’ expertise to provide a complete material, equipment and process solution, optimized for each individual customer’s process needs. Brewer Science is a global technology leader in creating, developing, and manufacturing specialty materials, equipment, and process solutions for applications in semiconductors, advanced packaging/3-D ICs, MEMS, sensors, displays, LEDs, and printed electronics. The company's 30 years of in-depth knowledge and expertise in materials science, chemistry, physics, optics, modelling, and process integration distinguish it from all other material suppliers worldwide.
