+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

GaAs TRITIUM Duo family is the tiniest for dual-band power

TriQuint says it's gallium arsenide based amplifiers offer mix-and-match two-band combinations. This gives mobile device manufacturers a flexible, high-performance platform that speeds up time to market

 TriQuint's new TRITIUM Duo family combines two band-specific power amplifiers (PAs) and two duplexers in a single compact module, effectively replacing up to twelve discrete components.

The company says it is the smallest dual-band PA duplexer (PAD) for global 3G and 4G smartphones. 



"We’ve powered the world’s top smartphones with over a half billion of our single-band TRITIUM modules, and now the TRITIUM Duo is being evaluated by customers for use in next generation smartphones," said Ralph Quinsey, president and chief executive officer of TriQuint. "Our broad technology portfolio has enabled us to integrate two commonly used bands in one small footprint. Not only have we simplified the RF front-end for phone designers, we have also increased performance and flexibility."

The TRITIUM Duo family shares a common 6 x 4.5mm footprint, giving designers the flexibility to support multi-band, multi-mode operations across multiple platforms. Mobile device manufacturers can capitalise on the large size reductions to include more features or larger batteries in thinner, lighter form factors with all the performance needed for CDMA, 3G, and 4G networks.

At about 50 mm2,, roughlyhalf the footprint of a comparable discrete solution, they offer improved manufacturing and supply chain efficiency. Optimised for each of its two bands, no switching is required after amplification, unlike configurable architectures.

The new dual-band TRITIUM Duo implements proprietary TriQuint CuFlip technology to replace wire bonds with copper bumps; this saves board real estate and enables superior system performance by eliminating noise-radiating wires.

The copper bumps also dissipate heat better than traditional interconnect techniques. The integrated Flip Chip BiHEMT power amplifier die achieves industry leading current consumption to provide maximum talk-time and thermal efficiency critical for smartphone applications.

The TRITIUM Duo also employs a wafer level packaging technique to provide hermetic filter encapsulation for improved performance and a reduced size. In addition, the modules integrate high-performance BAW and SAW duplexer capabilities.

TriQuint will showcase its mobile device platform solutions, including the new TRITIUM Duo family, at the GSMA Mobile World Congress in Barcelona, Spain, between February 27 and March 1, 2012. 



The TRITIUM Duo is currently sampling, with volume production is planned in June. 
Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: