News Article
Affordable benchtop IR inspection tool revealed by McBain
The microscope incorporates a high resolution indium gallium arsenide camera. It allows an operator to see through materials that are transparent in the infrared range between 740 nm and 1700 nm
McBain Systems is introducing a new, more affordable system for interior, infrared inspection, for semiconductor and other advanced technology industries.
The new BT-IR Benchtop Infrared Microscope System allows an operator to see through materials that are transparent in the infrared range between 740 nm and 1700 nm.
McBain BT-IR inspection system
Despite its lower price, McBain says the new BT-IR provides exceptional performance and precision. Initial experiments indicate that it is able to penetrate thicker, more highly doped materials with rougher surfaces than other systems, and deliver higher quality images.
The BT-IR yields submicron-precision optical measurements, and its staging provides up to 0.1 µm linear encoder resolution. What's more, the system is reputed to have the highest resolution 900 - 1700 InGaAs digital camera in its class.
“The new BT-IR System fills an important market niche,” notes Michael Crump, President and CEO of McBain Systems. “It is a manual system with a smaller footprint and lower price, yet it is designed to provide much of the power and flexibility of our higher end inspection systems. And users can start with the BT-IR and later scale up to one of our larger, more automated IR inspection systems, such as the DDR-300NIR or DDR-2000SWIR, as their needs grow.”
The McBain BT-IR system features a motorised XY stage with joystick controls to navigate, observe and measure bonded wafer/die alignments, find defects in a manual mode and determine material stress via the system’s optional birefringence capability.
The system is well suited for imaging, verification, inspection and metrology for a range of QA/Reliability and R&D applications. Typical in-process applications include verification of pre-bond and pre-hybridisation for critical-alignment applications. Post-process uses include validation, inspection, and measurement of critical sub-surface features in NIR / SWIR-transmissible materials.
Failure analysis applications include tool verification, part characterisation, qualification and environmental testing.
