+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

RFMD's new rGaN-HV process for power devices

The firm's new technology complements RFMD's two existing gallium nitride processes for high power RF applications and high linearity applications. As well as expanding its own opportunities in the power device market, the process will also be offered to foundry customers

RF Micro Devices has extended its GaN process portfolio to include a new technology optimised for high voltage power devices in power conversion applications.

RFMD's newest GaN process technology, known as "rGaN-HV", is claimed to enable substantial system cost and energy savings in power conversion applications ranging from 1 to 50 KW. The rGaN-HV delivers device breakdown voltages up to 900 V, high peak current capability, and ultra-fast switching times for GaN power switches and diodes.

The new technology complements RFMD's GaN 1 process, which is optimised for high power RF applications and delivers high breakdown voltage over 400 volts, and RFMD's GaN 2 process, which is optimised for high linearity applications and delivers high breakdown voltage over 300 volts. RFMD will manufacture discrete power device components for customers in its Greensboro, NC, wafer fab facility and provide access to rGaN-HV to foundry customers for their customised power device solutions.

Bob Bruggeworth, President and Chief Executive Officer of RFMD, comments, "The global demand for energy savings through improved power conversion efficiency is creating a tremendous opportunity for high-performance power devices based on RFMD's GaN power process technologies. We expect our newest GaN power process will expand our opportunities in the high-voltage power semiconductor market, and we are pleased to provide access to rGaN-HV to our external foundry customers to support their success in the high-performance power device market."

RFMD's Power Conversion Devices Product Line and Foundry Services Business Unit will exhibit a broad portfolio of GaN technologies and GaN power products at the PCIM Power Industry Conference, May 8-10, in Nuremberg, Germany.
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: