News Article
Carsem focusing on LED manufacturing
he firm has successfully assembled and qualified high brightness silicon substrate LED arrays and will begin offering high-volume, full turn-key manufacturing services. These include electrical testing, laser mark and tape-and-reel production
Carsem is now entering a partnership with a key customer to assemble and further develop LED packaging technologies.
The manufacturing process fully utilises the advantage of standard mass production process of assembly and test including matrix substrate design; auto die attach, wire bond and high reflection coating dispense; compression moulding through automould system; mapping of units on substrate and bin sort per test mapping.
This silicon substrate LED array offers higher white light brightness with much less energy required (over 50 lumens/watt). The life expectancy of the product is estimated to be 10 years. General applications can be home use, cars and special lighting effects.
Albert Law, Carsem's V.P. of World Wide Sales and Marketing says, "Because of our extensive experience in providing turnkey solutions, we are able to share our expertise with our LED customers and assist them in getting their products to market faster with turnkey solution on high density and high volume packaging, Carsem is expanding the company's portfolio to include LED packaging solutions for the high brightness LED applications."
Carsem's Chief Technology Officer, L.W. Yong adds, "By capitalising on our extensive semiconductor experience in materials, process & equipment we have successfully advanced into the LED arena and thereby enhancing the manufacturability and efficiency of high brightness LED."
