Oxford Instruments unveils new PlasmaPro 100 system
Oxford Instruments has launched the PlasmaPro 100 system, its latest generation etch and deposition tool. The NEW PlasmaPro 100 tool has up to 200mm single wafer production capability, offering excellent uniformity and high throughput on a range of applications The system is ideally suited to many key market applications, including HBLED, Semiconductor Electronics, Failure Analysis and Photovoltaics. The, innovative system that has been developed by Oxford Instruments to address the exacting needs of Production users, who demand the very latest technological innovations. This latest system offers an evolution of PECVD hardware delivering step changes in deposition rate of high quality SiO2 and SiNx , with corresponding reductions in cleaning overhead. It also features the latest generation of Cobra ICP source which delivers improvements in etch rate and feature control capability. With robotic handler and capability and ‘Plug and Play’ hardware and optimised processes, the enhanced system control infrastructure and software interface delivers improved diagnostics, reliability and serviceability for the customer. Providing a common platform for all Oxford Instruments Plasma Technology’s processes and technologies, the PlasmaPro 100 is a highly configurable system, with process chambers that are available as standalone modules or in cluster configurations. “All our tools boast industry leading technology and automation that are well proven with over 90% uptime”, comments Senior Product Manager Ian McKinlay, “This latest product release offers genuine process improvements delivering excellent uniformity and high throughput processes on a range of applications. With access to our exclusive library of over 6,000 process recipes, built up over 25 years as a leading plasma tool manufacturer, our customers are guaranteed an excellent product with comprehensive, market leading backup.”