News Article
KLA-Tencor unveils LED wafer inspector
The ICOS WI-2280 system is designed to provide manufacturers with greater flexibility, reduced cost of ownership and improved efficiency
KLA-Tencor Corporation has revealed its next-generation LED patterned wafer inspection tool, the ICOS WI-2280.
ICOS WI-2280
The tool is designed specifically for defect inspection and 2D metrology for LED applications.
But the ICOS WI-2280 also provides enhanced inspection capabilities and increased flexibility for power semiconductor wafers spanning two inches to eight inches in size.
The ICOS WI-2280 is KLA' fourth generation LED wafer inspection system and is built on its WI-22xx platform, delivering sensitivity with increased throughput.
What's more, the tool supports handling of whole wafers in carriers and diced wafers in hoop ring or film frame carriers to accommodate multiple media with minimal equipment changeover time.
The WI-2280 also features an enhanced rule-based binning defect classification and recipe qualification engine, enabling manufacturers to achieve faster yield learning during production ramps, as well as improve process control and process tool monitoring strategies in their manufacturing process.
"Increasingly, LED manufacturers are demanding improved detection and classification of yield relevant defects of interest, which enables them to take faster corrective actions to improve their yields at higher inspection throughput. There is also a growing need to boost productivity by enabling faster production recipe creation," says Jeff Donnelly, group vice president, Growth and Emerging Markets (GEM) at KLA-Tencor.
"The ICOS WI-2280 addresses critical market requirements, ultimately enabling LED manufacturers to achieve better lumens per watt and lumens per dollar performance. We remain committed to advancing our industry-leading ICOS product line to meet the LED community's emerging needs," continues Donnelly.
The ICOS WI-2280 includes flexible advanced optical modes with dedicated image processing. This enables a high defect capture rate and recipe robustness against varying process backgrounds.
The tool can also classify defects uniquely and has an advanced recipe tuning engine and enhanced metrology capability.
Front-end to back-end-of-line connectivity analysis is also possible, delivering a single platform for defect source analysis. KLA says the system has an easy-to-use inline or offline reclassification engine. This enables post-inspection yield improvements for enhanced productivity
In addition to LED application environments, compound semiconductor and power device markets can leverage the ICOS WI-2280 tool for back-end-of-line and post-dicing outgoing quality control or binning; front-end-of-line patterned wafer inspection for baseline yield improvement, rework, excursion control or overlay; and 2D surface inspection and metrology.
The ICOS WI-2280 also works in conjunction with KLA-Tencor's Candela LED unpatterned wafer inspection system and Klarity LED automated analysis and defect data management system to provide manufacturers with end-to-end inspection coverage.
ICOS WI-2280
The tool is designed specifically for defect inspection and 2D metrology for LED applications.
But the ICOS WI-2280 also provides enhanced inspection capabilities and increased flexibility for power semiconductor wafers spanning two inches to eight inches in size.
The ICOS WI-2280 is KLA' fourth generation LED wafer inspection system and is built on its WI-22xx platform, delivering sensitivity with increased throughput.
What's more, the tool supports handling of whole wafers in carriers and diced wafers in hoop ring or film frame carriers to accommodate multiple media with minimal equipment changeover time.
The WI-2280 also features an enhanced rule-based binning defect classification and recipe qualification engine, enabling manufacturers to achieve faster yield learning during production ramps, as well as improve process control and process tool monitoring strategies in their manufacturing process.
"Increasingly, LED manufacturers are demanding improved detection and classification of yield relevant defects of interest, which enables them to take faster corrective actions to improve their yields at higher inspection throughput. There is also a growing need to boost productivity by enabling faster production recipe creation," says Jeff Donnelly, group vice president, Growth and Emerging Markets (GEM) at KLA-Tencor.
"The ICOS WI-2280 addresses critical market requirements, ultimately enabling LED manufacturers to achieve better lumens per watt and lumens per dollar performance. We remain committed to advancing our industry-leading ICOS product line to meet the LED community's emerging needs," continues Donnelly.
The ICOS WI-2280 includes flexible advanced optical modes with dedicated image processing. This enables a high defect capture rate and recipe robustness against varying process backgrounds.
The tool can also classify defects uniquely and has an advanced recipe tuning engine and enhanced metrology capability.
Front-end to back-end-of-line connectivity analysis is also possible, delivering a single platform for defect source analysis. KLA says the system has an easy-to-use inline or offline reclassification engine. This enables post-inspection yield improvements for enhanced productivity
In addition to LED application environments, compound semiconductor and power device markets can leverage the ICOS WI-2280 tool for back-end-of-line and post-dicing outgoing quality control or binning; front-end-of-line patterned wafer inspection for baseline yield improvement, rework, excursion control or overlay; and 2D surface inspection and metrology.
The ICOS WI-2280 also works in conjunction with KLA-Tencor's Candela LED unpatterned wafer inspection system and Klarity LED automated analysis and defect data management system to provide manufacturers with end-to-end inspection coverage.
