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CS Industry Award Winners 2013 Announced

Many of the largest players in the compound semiconductor industry were acknowledged by their customers in the voting process
Winners of the CS Industry Awards 2013 were announced on Monday 4th March at CS International, one of the world’s leading compound semiconductors conferences.

At this event, which attracted 300 delegates to the Sheraton Frankfurt Airport Hotel, Frankfurt, six companies netted awards in categories covering key areas associated with compound semiconductor manufacturing and chip development.



These winners included some of the biggest names in the field and included; TriQuint, Axitron, Cree, Jordan Valley, Ferrotec, and SETi.

TriQuint won the R&D Award for its involvement in the $2.7 million Near Junction Thermal Transport (NJTT). Commentating on this award, Richard Stevenson, editor of Compound Semiconductor magazine, said, "When it comes to thermal conductivity, diamond is gallium nitride's best friend. Uniting these two materials isn't easy, but TriQuint has made great strides in that direction. This will ultimately allow wide bandgap amplifiers to get closer to fulfilling their true potential."

The Compound Semiconductor Manufacturing Award went to Aixtron for the AIX G5+: 5 x 200mm GaN-on-Si MOCVD Reactor "GaN-on-silicon technology promises to revolutionise power electronics and slash the cost of LEDs, spurring a lighting revolution. One manufacturing tool that I'm tipping to play a major role in driving both these changes is the Aixtron AIX 5, a reactor that combines high throughout with impressive levels of uniformity." remarked Stevenson.

SETi was victorious in the category for the Device Design and Packaging with III-Nitride Varactors with Capacitively-Coupled Contacts "In the RF world, a great deal of value is placed on low-loss switching, high linearity, efficiency and device operation at high temperatures. The III-Nitride C3 varactor design excels in all these areas." said Stevenson

The Substrates and Materials Award went to CREE, multinational manufacturer of semiconductor materials and devices for 150-mm 4HN Silicon Carbide Epitaxial Wafers “The wide bandgap power electronics market is tipped to rocket throughout this decade” said Stevenson. Large diameter, high-quality substrates produced by Cree will help to drive this expansion."

Jordan Valley Semiconductors picked up the Metrology Test and Measurement Award with the QC3 Fast HRXRD Metrology Tool "X-ray diffraction is an essential characterization tool in many fabs. With many diffractometers this process can take hours, holding back fab throughput. But that's not the case with the QC3 High-Resolution X-Ray Diffractometer from Jordan Valley, which can scan wafers in a matter of seconds," claimed Stevenson.

Ferrotec-Temescal netted the Innovation Award for Auratus Deposition Enhancement Methodology "The price of gold has shot up in the last few years. However, thanks to Ferrotec, this hike in costs can by combated by improvements to deposition efficiency," predicted Stevenson.

Voting by the readers of Compound Semiconductor magazine and its associated web-site determined the winners of these awards. More than 20,000 votes were cast.

A full listing of the winners can be accessed via the website: http://www.csawards.net/winners/2013

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