The companies will work together to accelerating R&D of new materials and manufacturing processes for LEDs using Intermolecular's technology

Intermolecular and Epistar have signed a collaborative development program (CDP) and royalty-bearing IP licensing agreement to increase the efficiency and reduce cost of Epistar's LED devices.


Under this agreement, Epistar and Intermolecular engineers will try to leverage Intermolecular's High Productivity Combinatorial (HPC) technology platform to dramatically accelerate development and manufacturing qualification of novel materials and processes for advanced LED products.


"After a rigorous review of Intermolecular's capabilities through an initial collaboration engagement, we have seen how their combinatorial approach to materials innovation and device integration can augment Epistar's leadership in LED technology," says M. J. Jou, president of Epistar. "Collaboration with our industry partners has been critical to our world-leading R&D and manufacturing strategy. We are confident that leveraging Intermolecular's team and technology platform will further increase our competitive advantage."


The commercial LED market is highly competitive, and new technologies created by R&D are needed to both improve light output and to reduce costs. A multi-functional team of technologists from Epistar and Intermolecular will work together using the HPC Platform to accelerate the pace of R&D ten times or more compared to what can be achieved in a conventional LED lab.


"We are very excited to partner with Epistar, a global leader in LED manufacturing," comments Sandeep Nijhawan, senior vice president and general manager of Intermolecular's clean energy group. "Entering into a strategic engagement with a top-tier LED company like Epistar validates the applicability and disruptive potential of the HPC technology platform for LEDs, a market that continues to have tremendous room for growth and technology innovation."


Intermolecular's mission is to improve R&D efficiency in the semiconductor and clean energy industries through collaborations that use its HPC platform, which allows R&D experimentation to be performed at speeds up to 100 times faster than traditional methods.


 

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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