The firm says its new tool results in a perfect lamination process, which is the key to high-quality modules

One of the reasons why solar modules fail in the field is the insufficient cross-linking of ethylene vinyl acetate (EVA) caused by vacuum lamination process deviations or unstable EVA foil materials.

Laytec says the current standard tests are slow, destructive, manual, inaccurate and patchy.



X-Link in action

LayTec’s new off-line metrology system X Link provides fast, automated, non-destructive and accurate evaluation of EVA cross-linking degree immediately after lamination. It can be integrated in every solar module production line and offers 100 percent coverage for process and quality control.

The high precision measurements are performed through the backsheet without damaging the laminated surface.

They take only a few seconds, do not influence the performance of the tested module and have a precision of ± 1.5 percent.

With X Link’s direct feedback, the lamination process can be quickly optimised for better cross-linking quality by adjusting the heating zones and the duration of lamination. Laytec claims the result is a perfect lamination process, which is the key to high-quality modules.

The new off-line version of X Link will be presented at the SNEC PV Power Generation Conference & Exhibition in Shanghai in May (Booth E3/802-803) and Intersolar Europe in Munich in June (Booth A5/258).

 

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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