The VERSALINE processing tools will support backside GaAs RF power amplifier and switch chip production

A leading US wireless compound semiconductor device manufacturer has placed capacity driven, follow-on orders with Plasma-Therm LLC for VERSALINE wafer processing, etch modules.


The process systems will support RF power amplifier and switch chip production with advanced backside GaAs via formation. These chipsets are used primarily in handsets and other RF applications.


The process modules include Plasma-Therm’s EndPointWorks technology and unique active


feedback chamber temperature management to ensure maximum etch yield, reproducibility and uptime productivity.


These orders compliment an installed base of Plasma-Therm VERSALINE and Versalock systems at this site for multiple plasma-processing steps that includes both deposition and etch.


David Lishan, Director-Technical Marketing explains, “Based on a history of repeat orders, Plasma-Therm has been a key supplier to wireless compound semiconductor manufactures for many years.


Follow-on orders are especially encouraging as they confirm we are continuously providing solutions that meet the expectations of our customers. On time solutions, whether for capacity or technology needs, are a result of close collaboration with our customers."


 

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