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IPG launches UV laser micromachining system

In large-area exposure mode, the system can be used for surface annealing applications of semiconductors
IPG Photonics Corporation has introduced the IX-255 UV Laser Micromachining System.

This is an advanced, highly flexible system from IPG's Microsystems Division, for multi-purpose, R&D and small-scale production applications.

IPG's multi-functional system can be configured with a beam energy density up to 25 J/cm2 for applications such as drilling ceramic materials or with lower energy density for large-field exposures such as conformal coating removal, insulation-stripping and annealing. A third configuration allows the programmable selection of beam shapes for general-purpose patterning, cutting and machining of blind features.

IPG's IX-255 is a fully interlocked, Class 1 workstation built on a granite base and support structure for vibration minimisation and thermal stability with dual microscope vision systems for automated part alignment and inspection.

IX-255 UV laser micromachining system

The workstation is integrated with a proprietary UV laser. System software includes macro-building tools for fast programming and generation of automating processes for complex feature machining while additional utilities allow complex pattern input from standard CSV and DXF files.

Applications for the IX-255 include drilling and cutting of ceramics, patterning of microfluidic devices and machining of low taper-angle holes in polymers.

The IX-255 system can also be used in microelectronics for 3D micromachining, glass drilling and cutting, selective material removal (exposure of contact pads) and trimming of conductors. In large-area exposure mode, the system can be used for surface annealing applications of semiconductors, electrical connectors and biomedical devices.

To facilitate precise dose control, the IX-255 can be equipped with an optional Extended Beam Homogeniser that enhances beam uniformity while providing up to a doubling of system throughput in large-field exposure applications.

"IPG's IX-255 is intended for very high precision micromachining, advanced materials processing development and light duty manufacturing," states Jeffrey Sercel, President of IPG Microsystems. "It is easily configured with the full range of IPG Microsystems industrial grade beam-forming and micromachining functions that customers frequently request within a single laser workstation. The use of a high pulse energy UV laser, interchangeable beam delivery elements and fully integrated software results in a flexibility that makes the IX-255 the ideal general-purpose laser micromachining tool."

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