Info
Info
News Article

Cambridge Nanotherm & Optocap Ship First Chip-on-Heatsinks To LED Firm

The joint technology was chosen for its outstanding thermal performance, reduced costs and simplified supplier management and assembly
Cambridge Nanotherm is partnering with Optocap, an advanced microelectronic and optoelectronic packaging design and assembly company.

Together, the companies have shipped what they say is the first ever Chip-on-Heatsink modules to a customer in the LED industry.

“As a design and assembly service provider we need to ensure we specify materials that will enhance our customers’ products," says David Ruxton, CEO of Optocap. “We specified Cambridge Nanotherm’s technology due to the outstanding thermal performance it enables. It also means a reduced bill of materials, simplified supplier management and easier assembly for our customer."

Cambridge Nanotherm’s core IP is a unique process for converting aluminium into alumina. The process allows the surface of any aluminium object to be converted into a dielectric layer.



Cambridge Nanotherm  & Optocap exploded LED module

In the case of the Chip-on-Heatsink approach, an extruded heat sink or heat pipe can be coated and then metallised with the end user’s circuit design. Nanotherm’s technology enabled Optocap to utilise its manufacturing processes and allow direct assembly of die and surface mount components onto the heat sink, creating a fully integrated module.

This approach gives a number of benefits for LED lighting customers. For those using conventional PCB materials and heat sinks, the advantages are three-fold.

Firstly, a cost reduction is seen by the removal of both the MCPCB and thermal interface material (TIM) components.

Secondly, the removal of these layers give the most efficient thermal path between component and heat sink.

Finally, as a result of minimising thermal resistance, denser component layouts can be realised. For those using thick-film or thin-film metallised alumina and AlN ceramic heat sinks, the cost reduction is even more significant, while bulk thermal performance of the aluminium heat sink matches one made from AlN.

“We are very pleased to have Optocap as the world’s first commercial customer for the first ever Chip-on-Heatsink product," says Cambridge Nanotherm CEO, Pavel Shashkov. “Working with Optocap we were able to demonstrate that our product has clear technological advantages as well as real commercial benefits. We believe that this technology will change the rules of the game for manufacturers not just in the LED field but in the electronics industry as a whole".



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}
Live Event