Skyworks powers MediaTek's dual-core smartphone platforms
III-V and silicon integrated chips work together for smartphones
Skyworks Solutions has announced that MediaTek is leveraging several of Skyworks’ front-end solutions in its dual-core MT6572 platform.
This platform supports multiple tier-one smartphone manufacturers in emerging markets.
MediaTek, a fabless semiconductor company is supplying complete chipset solutions that couples its own baseband processor, radio, software, multimedia and connectivity product offerings, with front-end solutions to offer a turnkey approach to manufacturers who supply handsets to consumers around the world.
The MT6572 is said to be the world’s first dual-core, system-on-a-chip platform with high-speed-packet-access, integrated WiFi, FM, GPS and Bluetooth functionality delivered in a cost-effective, four-layer printed circuit board.
MT672 SOC chip
This system-level design reduces bill-of-material costs, simplifies the product development cycle and enhances time to market.
“MediaTek is excited to be extending its collaboration with Skyworks Solutions,” says Jeffrey Ju, general manager of the MediaTek’s smartphone business.
“Skyworks is a proven innovator and their leading-edge, best-in-class solutions make them the ideal partner as we look to deliver next-generation smartphones with features and performance associated exclusively with high-end platforms.”
“As the transition to smartphones in the emerging markets continues to accelerate, Skyworks is pleased to be working with MediaTek, a leader in system-on-chip cellular platforms,” continues Bradley C. Byk, senior vice president of worldwide sales at Skyworks.
He continues,“As the solutions provider of choice, Skyworks looks forward to capitalising on the exploding smartphone growth in emerging markets.”
Industry analysts expect future smartphone growth to come from emerging markets where consumers are upgrading from feature phones to entry-level platforms. According to IDC, 1.7 billion smart connected devices (tablets, smartphones and PCs) will be shipped worldwide in 2014.
Of those 1.7 billion units, 1 billion will be delivered to emerging markets, with smartphones and tablets comprising more than the majority of units. Specifically, IDC estimates emerging markets will see a compound annual growth rate of 17 percent from 2012 to 2017 for connected devices.
The new MT6572 integrates a power-efficient, dual-core Cortex-A7 central processing unit sub-system with speeds up to 1.2 gigahertz in 28nm. The new platform also integrates MediaTek’s advanced, multimode Rel. 8 HSPA+/TD-SCDMA modem, 3G graphics, support up to HD 720p video playback and record, 5 megapixel camera and up to qHD displays.
Supporting the leading picture quality technologies inherited from MediaTek’s extensive experience in the digital television market, the MT6572 delivers an innovative solution that offers the finest visual quality and outstanding user experience for high-end smartphone consumers.
The fully matched, 14-pad SKY77758 power amplifier (PA) module packs full coverage for Bands I, II, V, VIII into a single, compact 3.0 x 4.2 x 0.9 mm package.
The small and efficient surface mount module meets stringent spectral linearity requirements for WCDMA, HSDPA, HSUPA, HSPA+ transmission with high power-added efficiency. A directional coupler integrated into the module eliminates the need for any external coupler.
The single GaAs, microwave monolithic integrated circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits.
Output match into a 50Ω load is realised off-chip within the module package to optimise efficiency and power performance.
The SKY77590-11, SKY77590-21, SKY77590-51, SKY77590-61, SKY77593, SKY77594, SKY77595 and SKY77596 are transmit (Tx)/receive front-end modules designed in a very low profile (0.9 mm) and 6 x 6 mm compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800 and PCS 1900 operation.
The complete transmit VCO-to-antenna and antenna-to-receive, surface acoustic wave filter modules consist of Tx harmonic filtering, a high linearity/low insertion loss switch, and a complementary metal-oxide semiconductor, PA control block.
A custom silicon integrated circuit contains decoder circuitry to control the RF switch while providing a low current, external control interface.