News Article
Major LED manufacturer finds ALSI’s dicing system cutting edge
The tool will be used in the manufacture of GaN and GaP LEDs
Advanced Laser Separation International (ALSI) N.V. introduced its new laser dicing system, the ICA 1204 for GaN and GaP devices, at one of the world’s largest major LED manufacturers with great success.
ICA 1204 laser dicing system
The ICA1204 system is equipped with a specific UV laser and ALSI’s unique multi-beam laser splitting technology.
The overall process is based on a high speed full cut laser dicing process for wafers in the range of 150-200µm thick. Due to the specific nature of the applied coating, additional special coating process units were integrated into the system.
As a result, this new system outperformed ALSI’s previous models and a competitors system with significant results. The total cycle time including the specific coating process, multi-beam dicing and wafer cleaning, which are completely integrated in the system, was reduced by almost a factor two.
Since all the process steps are integrated inside the system, the operator cost and handling cost are reduced as well. ALSI says this combination of faster cycle time, reduced handling time, and fast dicing process, also reduced the overall cost per wafer by a factor 2.
The multi-beam process is based on 10-14 beams which achieves a very high dicing speed and a fast process time, while creating an extremely narrow kerf giving superior dicing quality.
This new process and system has been tested by customers resulting in firm orders and is used in full production.
ICA 1204 laser dicing system
The ICA1204 system is equipped with a specific UV laser and ALSI’s unique multi-beam laser splitting technology.
The overall process is based on a high speed full cut laser dicing process for wafers in the range of 150-200µm thick. Due to the specific nature of the applied coating, additional special coating process units were integrated into the system.
As a result, this new system outperformed ALSI’s previous models and a competitors system with significant results. The total cycle time including the specific coating process, multi-beam dicing and wafer cleaning, which are completely integrated in the system, was reduced by almost a factor two.
Since all the process steps are integrated inside the system, the operator cost and handling cost are reduced as well. ALSI says this combination of faster cycle time, reduced handling time, and fast dicing process, also reduced the overall cost per wafer by a factor 2.
The multi-beam process is based on 10-14 beams which achieves a very high dicing speed and a fast process time, while creating an extremely narrow kerf giving superior dicing quality.
This new process and system has been tested by customers resulting in firm orders and is used in full production.
