News Article

Oslon Black Flat LED Now Split Into Two

The compact Osram III-nitride based LED is suited for automotive headlights now comes with two chips for greater brightness

The Oslon Black Flat is now also available on the market as a 2-chip variant.

The Oslon Black Flat LED is now available with two chips ( KW H2L531)

As with other LEDs from the Oslon Black family, the new version also features a high level of brightness and is suitable for all headlight functions.

The major advantage of the new LED:As an SMT component it can be attached directly to the PCB and can then be processed further with other components as part of a standard soldering process. The simplicity of this implementation translates into large cost and time savings during further processing.

Thanks to UX:3 chip technology, the new Oslon Black Flat features a very high light output even with high currents, achieving over 500 lumens at 1 ampere. The high brightness level of the new LED is emitted from a very compact package with dimensions of merely 3.1 mm x 3.75 mm and a height of 0.5 mm.

“With the new Oslon Black Flat we're bringing a significantly more slender LED than the previous version into our portfolio to enable even more compact headlight systems," explains Florian Rommen, LED Automotive Marketing at Osram Opto Semiconductors. The 2-chip LED is suitable for all headlight functions, primarily for daylight running light with light guides, as well as generally for low beam and high beam light.

Oslon Black Flat in car headlights. Cyclic stability, homogeneous light distribution, small package dimensions and more: the new 2-chip LED from Osram Opto Semiconductors lines up with a wealth of advantages

Cost savings with Surface Mount Technology (SMT)

As a surface mountable component, the new Oslon Black Flat can be, akin to other electronic components, attached simply to a circuit board and processed further as part of standard soldering.

“This soldering capability enables processing the LED in a simple, standardised process and reduces the complexity of the processing steps, which saves a good deal of time and costs," continues Rommen.

Oslon Black Flat - good stability and homogeneous light distribution Further benefits of the Oslon Black Flat are their homogeneous distribution of light, very good contrast ratio and cyclic stability.

The black QFN (Quad Flat No Leads) housing expands in a similar manner to the circuit board during high temperature cycle loads. As a result, soldered joints are considerably stronger and exposed to much less strain.

A special sealing technology together with the sophisticated package and ceramic converter enable the highly uniform distribution of light as well as good contrast conditions on roads:

Chip encapsulation is directly in the package to achieve a defined bright/dark border in the light beam, and the high contrast of the luminous surface of both chips in relation to the package also contributes to this.

Samples of the Oslon Black Flat are available now, and volume start-up is planned for the turn of the year.

Oslon Black Flat (KW H2L531) technical data:

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.



Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
Live Event