News Article
Peregrine advances future of RF design with SOI solution
New generation of UltraCMOS technology delivers first step in solving challenges encountered in RF front-end integration design
Peregrine Semiconductor Corp, founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, has announced the UltraCMOS 10 platform, the newest advancement in Peregrine’s UltraCMOS technology.
UltraCMOS 10 RF SOI is addressing the increasing challenges of RF front-end design. By combining UltraCMOS technology with the economies of SOI, the company says 50-percent performance improvement over comparable solutions is possible.
Peregrine’s new 130 nm UltraCMOS 10 technology will support the latest generation of LTE-Advanced smartphones and, for the first time, will allow the company to deliver cost-competitive products for 3G smartphones.
Peregrine is enhancing a long-term relationship and leveraging a new one for the UltraCMOS10 introduction – Soitec’s semiconductor materials coupled with GLOBALFOUNDARIES’ custom fabrication flow.
Paul Boudre, COO at Soitec says, “We are very pleased that Soitec’s revolutionary-engineered semiconductor materials support Peregrine’s next-generation UltraCMOS 10 technology.” Ajit Manocha, CEO at GLOBALFOUNDRIES describes the collaboration with Peregrine and comments: “GLOBALFOUNDRIES seeks partnerships with leaders in their market categories, and we are delighted the opportunity arose to work with Peregrine Semiconductor. Together, we co developed a custom flow to help make Peregrine’s new UltraCMOS 10 generation a truly cutting-edge advance in RF SOI.”
Smartphone manufacturers face a number of tough design challenges, including balancing performance requirements with cost and maintaining consumers’ signal quality and data-rate speeds despite the increasing number of frequency bands and volume of data.
Mobile Experts’ Principal Analyst of Radio Access and RF Semiconductors Joe Madden offers his perspective on the challenges and growth curve of the smartphone market, “The iPhone 5S has more than double the frequency bands than the iPhone 5, and this is just one example of how dramatically the requirements for smartphone components are increasing. LTE units are expected to grow from 150 million in 2012 to 1.2 billion in 2018 (42 percent CAGR).”
Jim Cable, CEO at Peregrine Semiconductor, sums up Peregrine’s latest milestone: “Peregrine is applying 25 years of RF SOI knowledge to deliver the market’s highest level of integration for RF front-end design capability.”
UltraCMOS 10 RF SOI is addressing the increasing challenges of RF front-end design. By combining UltraCMOS technology with the economies of SOI, the company says 50-percent performance improvement over comparable solutions is possible.
Peregrine’s new 130 nm UltraCMOS 10 technology will support the latest generation of LTE-Advanced smartphones and, for the first time, will allow the company to deliver cost-competitive products for 3G smartphones.
Peregrine is enhancing a long-term relationship and leveraging a new one for the UltraCMOS10 introduction – Soitec’s semiconductor materials coupled with GLOBALFOUNDARIES’ custom fabrication flow.
Paul Boudre, COO at Soitec says, “We are very pleased that Soitec’s revolutionary-engineered semiconductor materials support Peregrine’s next-generation UltraCMOS 10 technology.” Ajit Manocha, CEO at GLOBALFOUNDRIES describes the collaboration with Peregrine and comments: “GLOBALFOUNDRIES seeks partnerships with leaders in their market categories, and we are delighted the opportunity arose to work with Peregrine Semiconductor. Together, we co developed a custom flow to help make Peregrine’s new UltraCMOS 10 generation a truly cutting-edge advance in RF SOI.”
Smartphone manufacturers face a number of tough design challenges, including balancing performance requirements with cost and maintaining consumers’ signal quality and data-rate speeds despite the increasing number of frequency bands and volume of data.
Mobile Experts’ Principal Analyst of Radio Access and RF Semiconductors Joe Madden offers his perspective on the challenges and growth curve of the smartphone market, “The iPhone 5S has more than double the frequency bands than the iPhone 5, and this is just one example of how dramatically the requirements for smartphone components are increasing. LTE units are expected to grow from 150 million in 2012 to 1.2 billion in 2018 (42 percent CAGR).”
Jim Cable, CEO at Peregrine Semiconductor, sums up Peregrine’s latest milestone: “Peregrine is applying 25 years of RF SOI knowledge to deliver the market’s highest level of integration for RF front-end design capability.”
