News Article

Nanoimprint Lithography Tool For Photonics And LEDs From EVG

The EVG720 UV-NIL system provides excellent throughput and low cost of ownership with integrated soft template replication capability
EV Group (EVG) has introduced the EVG720 automated UV nanoimprint lithography (UV-NIL) system.

Providing full-field imprint lithography with an integrated soft stamp/template fabrication capability, the EVG720 system enables throughputs of more than 60 wafers per hour with the lowest cost of ownership (CoO). 

EVG720 UV nanoimprint lithography system

Capable of printing nanostructures as small as 40 nm in diameter over a large area in volume production, the EVG720 system is ideally suited for use in manufacturing optics, photonics, LEDs, microfluidics and other bioMEMS devices, as well as advanced data storage devices. Several systems have already been installed, evaluated and accepted at customer sites.

The EVG720 UV-NIL system - EVG's most advanced dedicated NIL system - utilises a next-generation UV-NIL process designed specifically to address the needs of high-volume manufacturing. It combines high throughput, ease of use and high resolution - enabling volume manufacturing of nanoscale structures at the lowest CoO. 

EVG's UV-NIL solutions, including the EVG720 system, are designed to work with a wide variety of resist materials. This open materials platform approach provides customers with a high degree of flexibility and process customisation.

In addition, the EVG720 has an integrated stamp replication capability, which minimises tool footprint and avoids increased capital equipment costs associated with stand-alone replication systems. EVG's soft working stamps have optimised releasing properties that extend the life of the stamp and enable ideal imprint results on both flat and rough substrates. 

Traditional stamps wear down quickly or require additional surface treatment after each imprint and result in increased defectivity on the substrate that leads to yield loss, as well as increased costs from continuous replacement.

"EV Group continues to extend its leadership in low-cost, high-throughput and reliable NIL solutions with our new EVG720 platform, which is built on nearly 20 years of experience with more than 100 UV-based imprint lithography systems in the field," states Gerald Kreindl, business development manager at EV Group. 

"We recognise that a one-size-fits-all approach to NIL can't address every customer's unique manufacturing requirements, which is why EV Group has created a complete NIL solutions portfolio that encompasses all widely accepted imprint techniques - UV-NIL, hot embossing, micro contact printing, step-and-repeat, full-field, and roll-to-roll imprint. In addition, we are continuously working to improve the imprint lithography infrastructure by collaborating with companies and research organisations throughout the imprint lithography supply chain," he continues.

EVG will describe its latest developments in nanoimprint lithography and other processing solutions at the company's booth #4B-207 in the Makuhari Messe International Convention Complex in Chiba, Japan at SEMICON Japan. The show will take place from December 4th to 6th.

During the show's technical program, EVG will present "EVG's HVM solution updates for automotive and smart phone applications," during the Exhibitor Seminar on Wednesday, December 4th from 2:30 to 3:20 p.m. at the International Conference Halls, Room 103. 

Also, Masaya Kawano, head of technology Japan / applications engineer for the Technology Division of EV Group Japan, will present "Latest wafer bonders which drive 3D-IC technology" at the Proposals to the Assembly Technologies to Drive 3D-IC session on Friday, December 6th from 1:45 to 2:00 p.m. at the TechSTAGE West, Hall 1.


AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.



Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
Live Event