News Article

Plessey Orders ALSI Laser Dicing Tool For LEDs

The system will be used for GaN-on-silicon LED wafers
Advanced Laser Separation International (ALSI) NV has received an order for a laser dicing system from Plessey Semiconductors for its Plymouth, UK based LED manufacturing facility.

Keith Strickland, Chief Technology Officer at Plessey says, “An essential process step to achieve our cost and LED performance targets is the singulation of the finished wafer into LED dies. ALSI demonstrated their experience in dicing and proved in short turnaround time to be able to meet our challenging process, cost and delivery requirements. ALSI’s multi-beam process will be key to the back-end processes to be included in the fabrication line in Plymouth."

ALSI advanced laser dicing system

Rene Hendriks, director of Commerce of ALSI adds, “Plessey has introduced and started to commercialise new GaN-on-silicon LEDs and we are very pleased that Plessey selected our system to support the roadmap for lowering the cost of LEDs. Once more the multi-beam demonstrated to be able to dice wafers with high productivity while requiring very narrow dicing streets allowing high wafer yield for such small devices on very fragile base material".

Plessey are in the development and manufacture of semiconductor products used in sensing, measurement and controls applications. These products are found in a wide range of markets including communications, medical, defence, aerospace and automotive.

The company is currently concentrating on GaN-on-silicon LEDs.

Plessey has started to commercialise its low cost High Brightness LED products, and also plans to develop a range of smart-lighting products that incorporate its existing sensing and control technologies.

Advanced Laser Separation International (ALSI) NV laser dicing technology is based on a patented multi-beam laser technology. The systems are installed worldwide and are used for the dicing or grooving of LED-, RFIC-, T&D- and IC-applications.

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