News Article
Evatec enhances GaAs PVD processing capabilities in U.S.
The company has delivered multiple RADIANCE cluster sputter tools to a major US GaAs fab supplying products to the RF industry
Evatec is shipping tools to support expansion of the fab’s 6” GaAs production requirements to an undisclosed U.S. company.
The system enables implementation of new bump metallisation and high fill ratio barrier layer processes leading to significant cost savings.
Pictured below is a typical RADIANCE cluster tool with twin cassette stations, central handler with dual arm robot connected to three process modules- a batch process module with five sputter sources, a single process module with one large cathode , and a single process module configured with three smaller sources for co-deposition.
Evatec RADIANCE tool
Evatec says it was chosen for their high throughput and superior process stability leading to increased yield and reliability performance.
RADIANCE itself is a sputter tool, which can be configured for multiple technologies on a single platform. Single process modules can be configured for PVD, PECVD or ICP etch, whilst a 6 process position 'BATCH' module can be equipped for sputter and etch processes, allowing for in-situ processes on the same platform.
The RADIANCE flexibility combined with process knobs such as substrate rotation, target to substrate distance and in situ metrology capabilities such as optical monitoring makes the tool an ideal choice for development and production facilities across a wide range of market applications from compound semiconductors to optoelectronic applications.
Evatec delivers complete process solutions for thin film deposition and etch to the semiconductor, MEMS, optical and optoelectronic industries around the globe. With a technology portfolio including enhanced evaporation and sputtering, Evatec engineers are able to offer practical production advice from R&D to mass production.
The system enables implementation of new bump metallisation and high fill ratio barrier layer processes leading to significant cost savings.
Pictured below is a typical RADIANCE cluster tool with twin cassette stations, central handler with dual arm robot connected to three process modules- a batch process module with five sputter sources, a single process module with one large cathode , and a single process module configured with three smaller sources for co-deposition.
Evatec RADIANCE tool
Evatec says it was chosen for their high throughput and superior process stability leading to increased yield and reliability performance.
RADIANCE itself is a sputter tool, which can be configured for multiple technologies on a single platform. Single process modules can be configured for PVD, PECVD or ICP etch, whilst a 6 process position 'BATCH' module can be equipped for sputter and etch processes, allowing for in-situ processes on the same platform.
The RADIANCE flexibility combined with process knobs such as substrate rotation, target to substrate distance and in situ metrology capabilities such as optical monitoring makes the tool an ideal choice for development and production facilities across a wide range of market applications from compound semiconductors to optoelectronic applications.
Evatec delivers complete process solutions for thin film deposition and etch to the semiconductor, MEMS, optical and optoelectronic industries around the globe. With a technology portfolio including enhanced evaporation and sputtering, Evatec engineers are able to offer practical production advice from R&D to mass production.
