News Article
Molex zCD AOC Interface Scalable Up To 400 Gbps
CDFP module is the first 400 Gb/s form factor and will enable the highest port and bandwidth density of any pluggable form factor
The interface of the recently released Molex Incorporated zCD active optical cable (AOC) interconnect solution has been selected by the CDFP MSA as the interface for the consortium’s 400 Gbps hot pluggable module.
“We are pleased to bring to market one of the highest density interconnect assemblies available today,” states Scott Sommers, global group product manager, Molex. “The zCD AOC solution delivers a winning form factor that will serve to advance industry adoption of 400 Gbps data rate technology.”
Scalable up to 400 Gbps, the zCD interconnect is suitable for high bandwidth telecommunications, networking and enterprise computing data signaling rates. Based on singlemode silicon photonics technology, the Molex zCD AOC assembly transmits 28 Gbps over 16 bi-directional channels with robust signal integrity, electromagnetic interference (EMI) protection and thermal cooling properties. The tight pitch of the zCD interconnect solution enables OEMs to design systems of up to 5 terabytes capacity on one line card.
The zCD AOC transmits up to 4km for a fraction of the cost and power of long-reach optical modules. At 6W of power dissipation, it promises one of industry’s lowest power fiber optic solutions and longest AOC reaches. The zCD AOC assemblies are designed for Ethernet, InfiniBand and proprietary protocol applications.
The mating zCD connector is available in a short body version for passive or active copper cables and a long body version for AOCs and transceivers and features a straight, back-route footprint with a 0.75mm pitch. An elastomeric gasket or metal spring fingers provides EMI containment and suppression. Designed to accept a broad range of thermal modules and heat sinks, the press-fit connector design ensures a robust and simple board termination.
“The zCD interconnect solution offers a high level of integration, performance and long-term reliability for Molex customers requiring 400 Gbps with individual lane data rates up to 28 Gbps,” adds Sommers.
“We are pleased to bring to market one of the highest density interconnect assemblies available today,” states Scott Sommers, global group product manager, Molex. “The zCD AOC solution delivers a winning form factor that will serve to advance industry adoption of 400 Gbps data rate technology.”
Scalable up to 400 Gbps, the zCD interconnect is suitable for high bandwidth telecommunications, networking and enterprise computing data signaling rates. Based on singlemode silicon photonics technology, the Molex zCD AOC assembly transmits 28 Gbps over 16 bi-directional channels with robust signal integrity, electromagnetic interference (EMI) protection and thermal cooling properties. The tight pitch of the zCD interconnect solution enables OEMs to design systems of up to 5 terabytes capacity on one line card.
The zCD AOC transmits up to 4km for a fraction of the cost and power of long-reach optical modules. At 6W of power dissipation, it promises one of industry’s lowest power fiber optic solutions and longest AOC reaches. The zCD AOC assemblies are designed for Ethernet, InfiniBand and proprietary protocol applications.
The mating zCD connector is available in a short body version for passive or active copper cables and a long body version for AOCs and transceivers and features a straight, back-route footprint with a 0.75mm pitch. An elastomeric gasket or metal spring fingers provides EMI containment and suppression. Designed to accept a broad range of thermal modules and heat sinks, the press-fit connector design ensures a robust and simple board termination.
“The zCD interconnect solution offers a high level of integration, performance and long-term reliability for Molex customers requiring 400 Gbps with individual lane data rates up to 28 Gbps,” adds Sommers.
