Brewer Science commercialises megasonic developer for compound semiconductor applications
Megasonic developer applies uniform acoustic energy to spinning substrates to gently dissolve and remove films and residues without damaging fragile device structures
Brewer Science, a supplier of advanced materials, processes, and equipment to the microelectronics industry, has announced the first commercial placement of a Cee 300MXD megasonic developer. This innovative developer was commissioned by MicroChem Corp.
The Brewer Science Cee 300MXD megasonic developer applies uniform acoustic energy to spinning substrates to gently dissolve and remove films and residues without damaging fragile device structures. This precision handling results in stable dimensional control of vertical profiles uniformly across the wafer surface, enabling fabrication of high-aspect-ratio structures for the MEMS, display, compound semiconductor, and advanced packaging markets. Applications include radio-frequency (RF) power, MEMS, sensors, and acoustic wave devices used for wireless communication.
“MicroChem is very pleased to team with Brewer Science on what we believe could be an enabling technology for the future," said Michael Stan, Applications Engineering Manager for MicroChem Corp. "As the MEMS industry and integrated packaging technology continue to demand higher-aspect-ratio structures for TSV and RDL layers, enhanced development techniques will likely become mainstream. The cost-effective approach being pioneered by Brewer Science gives a supplier such as MicroChem Corp. the advantage of being able to rapidly prototype formulations and processes to meet these demands,” he added.
“The Cee 300MXD developer features state-of-the-art technology that creates a viable pathway for our customers to decrease process cycle times, reduce cost of ownership, and accelerate time to market,” said Justin Furse, Brewer Science Equipment Technology Strategist.
The Cee 300MXD megasonic developer gives customers a bridge from the lab to production by allowing them to avoid significant capital investment and is suitable for low-volume prototyping with a seamless transition to high-volume manufacturing.