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Palomar Technologies joins NCDMM alliance

The provider of optoelectronic packaging systems, along with NCDMM and its alliance members, is aiming to reduce manufacturing and machining costs
Palomar Technologies has been approved as an Alliance Partner by the National Centre for Defence Manufacturing and Machining (NCDMM).

The firms was approved as a member at the NCDMM Board of Directors’ meeting which was held on May 6th, 2014.

Palomar was welcomed by NCDMM to a select group of organisations interested in working with the Centre to implement advanced manufacturing technology within the U.S. Department of Defence (DoD) and its supply base.

The NCDMM’s mission is to promote the use of cost-effective manufacturing solutions by current, as well as future, U.S.- based producers of Department of Defence (DoD) systems by assisting with the ongoing identification and implementation of, and transition to, state-of-the-art manufacturing and technology solutions.

“On behalf of all of us at NCDMM, we are proud to welcome MAYA Design, Navista, Palomar Technologies, The Lucrum Group, and UPS into the ranks of our distinguished team of Alliance Partners,” says Randy Gilmore, NCDMM Vice President and Chief Technology Officer. “The ongoing collaboration between our Alliance Partners, Manufacturing Consortium, and internal staff is essential to supporting our industry and providing our customers with the most innovative and effective technologies available today.”

Alliance Partners at NCDMM take an active role in identifying, developing, demonstrating, and deploying new solutions in partnership with the NCDMM. NCDMM is aiming to reduce manufacturing and machining costs, enabling more critical hardware and supplies to be available for US defence troops. 

Palomar Technologies, a former subsidiary of Hughes Aircraft, is a provider of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilise its products, services and solutions to meet their needs for optoelectronic packaging. complex hybrid assembly and micron-level component attachment.
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