The business combination is still subject to approval by both TriQuint's and RFMD's shareholders, other required regulatory approvals, and customary closing conditions

RF Micro Devices, Inc. and TriQuint Semiconductor, Inc. have announced that the applicable waiting period under the U.S. Hart-Scott-Rodino Antitrust Improvements Act of 1976 has expired.

The amended HSR Act, in the business combination between RFMD and TriQuint, expired on 11:59 p.m. EDT on June 13th 2014, with no action by the Federal Trade Commission or the Department of Justice.

On February 24th 2014, RFMD and TriQuint announced that it had entered into a definitive merger agreement under which the companies will combine under a new holding company in an all-stock, merger-of-equals transaction.

Upon completion of the transaction, RFMD shareholders will receive 0.25 of a share of common stock of the new holding company for each share of RFMD common stock, and TriQuint shareholders will receive 0.4187 of a share of common stock of the new holding company for each share of TriQuint common stock.

The companies anticipate that RFMD shareholders, on the one hand, and TriQuint shareholders, on the other hand, will each hold approximately 50 percent of the shares of common stock of the new holding company issued and outstanding immediately after completion of the transaction.

Completion of the HSR Act waiting period should satisfiy one of the conditions required to finalise the transaction.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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