News Article

TrendForce: Chinese LED Lighting Package Manufacturers Booming

Lighting-use LED component market share last year surpassed 40 percent making it the sector with the largest market demand in the Chinese LED package industry
Chinese LED package manufacturers sales performance in 2013 was mediocre, the LED package market value was up slightly by 16 percent due to plunging prices, according to the latest “2014 Chinese Package Industry Market Report," by LEDinside, a research division of TrendForce.

As can be seen from each application market, display-use LED component market demands clearly declined as a result of easing market growth and falling prices.

In addition, backlight-use LED components, which currently have a saturated market demand, will have limited growth as technology improvements bring down usage volume. Chinese package manufacturers growth was mainly driven by lighting-use LED components.

In 2013, lighting-use LED component market share surpassed 40 percent making it the sector with the largest market demand in the Chinese LED package industry.

Distribution of Chinese LED package component application in 2013


Source: LEDinside

Manufacturers with their main business in lighting-use LED components such as Honglitronic, ChangFang Light, MLS Lighting and others, showed a clear growth in their lighting-use LED component business in 2013.

Last year, Honglitronic and ChangFang Light’s revenue increased 39 percent and 41 percent respectively. Refond Optoelectronics, who focuses on mid to large sized backlight LED market, saw an increase of 84 percent in lighting-use LED sales performance. Small size backlight manufacturer Jufei Optoelectronics’ lighting-use LED component revenue also grew 84 percent.

Rapid upstream chip industry development has been the propeller behind the fast emerging Chinese package manufacturers, due to low-priced LED chips and geographical advantages where local LED package manufacturers have the advantage of being close to local resources.

Ample manufacturing resources and factory distribution gives Chinese downstream lighting industry an advantage in cost and manufacturing. During the first half of 2014, San’an Optoelectronics (San’an Opto), HC SemiTek, and Tongfang utilisation rates reached full capacity of 100 percent.

ElecTech also saw an increase and estimates remaining MOCVD will be put into production during the second half of 2014. Over the next few years, San’an Opto, HC SemiTek and other large Chinese chip manufacturers will continue to expand production capacity. Among them, San’an Opto plans to introduce another 200 MOCVD sets by 2018, expanding production capacity mainly for lighting applications.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.



Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
Live Event