Quantum Dots To Combat Piracy
3D printing technology embeds quantum dots to produce unique security signature
Quantum Materials Corporation, based in Texas USA, has acquired a technology to embed quantum dots into 3D-printed objects as a kind of security signature. QMC hopes that this 3D-printing/additive manufacturing approach, developed at Virginia Tech in the US, will be a way of protecting 3D printed objects from being copied.
QMC is known for making tetrapod-shaped quantum dots (QD) for medical, display, solar energy and lighting applications. Compared to their spherical cousins, tetrapod QDs offer advantages such as higher brightness, more colours, the use of less active material, better stability and longer lifetime.
By using tetrapod quantum dots with specific structural characteristics, or dual emission tetrapods that can emit two different colours, the company says it can further increase the security measures inherent in the Virginia Tech process.
"The remarkable number of variations of semiconductor nanomaterials properties QMC can manufacture, coupled with Virginia Tech's anticounterfeiting process design, combine to offer corporations extreme flexibility in designing physical cryptography systems to thwart counterfeiters," said David Doderer, QMC's VP for research and development.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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