Peregrine And RFMD Settle Their Differences
Companies agree to enter into patent cross licenses
Peregrine Semiconductor and RF Micro Devices have announced that they have settled all outstanding claims between the companies. The two parties have entered into patent cross licenses and have agreed to dismiss all related litigation.
"We are pleased that we have reached agreement with RF Micro Devices and resolved all of our outstanding litigation under terms that recognize Peregrine's unique role in the invention and commercialisation of RF SOI technology," said Jim Cable, CEO of Peregrine Semiconductor. "This agreement provides validation for the many ways in which Peregrine continues to expand the industry's technological frontiers through both our inventions and commercial products. We look forward to continuing to solve our customers' and partners' toughest RF challenges."
Bob Bruggeworth, president and CEO of RFMD, said: "We are very pleased to reach an agreement with Peregrine that recognizes the value of their patents and their contribution to the development of RF SOI. The signing of this patent cross-license agreement allows RFMD to focus 100 percent on building the industry's leading portfolio of RF solutions, making this agreement very positive for both our Company and our customers."
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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